ST72F63BE2M1 STMicroelectronics, ST72F63BE2M1 Datasheet - Page 171

• Manufacturer Part Number: ST72F63BE2M1
• Description: MCU 8BIT LS USB 8KB FLASH 24SOIC
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72F63BE2M1

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I²C, SCI, USB
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 14
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 24-SOIC (7.5mm Width)
• Data Converters: A/D 12x10b
• Processor Series: ST72F6x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 384 B
• Interface Type: I2C, SCI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 14
• Number Of Timers: 1
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST7MDTU3-EPB/US, ST7MDTULS-EVAL, ST72F63B-SK/RAIS, ST7MDTU3-EMU3, STX-RLINK
• Minimum Operating Temperature: 0 C
• For Use With: 497-8209 - BOARD EVAL USB STUSB02E/ST72F63B497-8208 - BOARD EVAL USB STUSB03E/ST72F63B497-5521 - EVAL BOARD LOW SPEED USB497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-5624-5

ST7263Bxx
14.2
14.3
Thermal characteristics
Table 85.
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
Soldering and glueability information
Recommended glue for SMD plastic packages dedicated to molding compound with
silicone:
●
●
of an application can be defined by the user with the formula: P
internal power (I
application.
Heraeus: PD945, PD955
Loctite: 3615, 3298
Symbol
T
R
P
Jmax
thJA
D
Thermal characteristics
DD
x V
Package thermal resistance (junction to
ambient)
SDIP32
LQFP48
QFN40
Power dissipation
Maximum junction temperature
SO34
SO24
DD
) and P
PORT
Doc ID 7516 Rev 8
the port power dissipation depending on the ports used in the
(1)
Ratings
(2)
D
D
=P
= (T
INT
J
-T
+ P
A
) / R
PORT
Package characteristics
thJA
where P
. The power dissipation
Value
500
150
60
75
70
80
34
INT
is the chip
°C/W
171/186
Unit
mW
°C