DSPIC30F4013-20E/PT Microchip Technology, DSPIC30F4013-20E/PT Datasheet - Page 208

• Manufacturer Part Number: DSPIC30F4013-20E/PT
• Description: IC DSPIC MCU/DSP 48K 44TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F4013-20E/PT

• Program Memory Type: FLASH
• Program Memory Size: 48KB (16K x 24)
• Package / Case: 44-TQFP, 44-VQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, POR, PWM, WDT
• Number Of I /o: 30
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 13x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 30
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 44TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 13-chx12-bit
• Number Of Timers: 5
• Core Frequency: 20MHz
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 30
• Flash Memory Size: 48KB
• Supply Voltage Range: 2.5V To 5.5V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC30F006 - MODULE SKT FOR DSPIC30F 44TQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F401320EPT

dsPIC30F3014/4013
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS70138E-page 206
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
A1
Dimension Limits
1
2
E
EXPOSED
A
NOTE 1
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
PAD
E2
1
2
0.80
0.00
6.30
6.30
0.25
0.30
0.20
MIN
N
MILLIMETERS
0.65 BSC
0.20 REF
8.00 BSC
8.00 BSC
BOTTOM VIEW
NOM
0.90
0.02
6.45
0.40
6.45
0.30
44
Microchip Technology Drawing C04-103B
–
D2
© 2007 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
–
K
e
b