STM32F103R8H7 STMicroelectronics, STM32F103R8H7 Datasheet - Page 54

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STM32F103R8H7

Manufacturer Part Number
STM32F103R8H7
Description
MCU 32BIT 64K FLASH 64BGA
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F103R8H7

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
64-LFBGA
Processor Series
STM32F103x
Core
ARM Cortex M3
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ST-LINK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Electrical characteristics
54/99
Low-speed internal (LSI) RC oscillator
Table 25.
1. V
2. Based on characterization, not tested in production.
3. Guaranteed by design, not tested in production.
Wakeup time from low-power mode
The wakeup times given in
oscillator. The clock source used to wake up the device depends from the current operating
mode:
All timings are derived from tests performed under ambient temperature and V
voltage conditions summarized in
I
t
Symbol
DD(LSI)
su(LSI)
DD
f
Stop or Standby mode: the clock source is the RC oscillator
Sleep mode: the clock source is the clock that was set before entering Sleep mode.
LSI
= 3 V, T
(2)
(3)
(3)
LSI oscillator characteristics
A
= –40 to 105 °C unless otherwise specified.
Frequency
LSI oscillator startup time
LSI oscillator power consumption
Table 26
Doc ID 13587 Rev 13
Parameter
Table
is measured on a wakeup phase with a 8-MHz HSI RC
9.
(1)
Min
30
STM32F103x8, STM32F103xB
0.65
Typ
40
Max
1.2
60
85
DD
supply
Unit
kHz
µA
µs

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