STM32F103R8H7 STMicroelectronics, STM32F103R8H7 Datasheet - Page 92

• Manufacturer Part Number: STM32F103R8H7
• Description: MCU 32BIT 64K FLASH 64BGA
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103R8H7

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 20K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-LFBGA
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ST-LINK
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Revision history
8
92/99
Revision history
Table 60.
01-jun-2007
20-Jul-2007
Date
Document revision history
Revision
1
2
Initial release.
Flash memory size modified in
BGA100 pins added to
definitions.
ballout
T
AC timing
t
characteristics. I
characteristics.
Sample size modified and machine model removed in
discharge
Number of parts modified and standard reference updated in
latch-up. 25 °C and 85 °C conditions removed and class name modified
in
added to
added to
Figure 31: I2C bus AC waveforms and measurement circuit
Figure 30: Recommended NRST pin protection
Notes removed below
I
in Run and Sleep
t
characteristics.
In
endurance and data retention for T
T
V
voltage. Document title changed.
section modified.
Figure 13: Power supply scheme
Features on page 1
SU(LSE)
DD
STAB
A
HSE
BG
Table 33: Electrical
Table 29: Flash memory endurance and data
= 25 °C removed.
Doc ID 13587 Rev 13
typical values changed in
changed to V
, V
changed to T
added.
REF+
changed to t
Table 35: I/O static
Table 38: NRST pin
diagram. V
(ESD).
Figure 3: STM32F103xx performance line LFBGA100
value, t
DD(HSI)
modes.
REFINT
LSE
list optimized. Small text changes.
lat
SU(HSE)
BAT
sensitivities. R
Table
in
and f
Table 5: Medium-density STM32F103xx pin
max value added to
in
ranged modified in
Figure 22: Low-speed external clock source
Table 39: TIMx characteristics
Table 12: Embedded internal reference
TRIG
9,
characteristics. R
in
characteristics.
Table 11: Maximum current consumption
Changes
Table
Note
Table 22: HSE 4-16 MHz oscillator
added to
modified.
Controller area network (CAN)
A
= 85 °C added, data retention for
PU
8,
38,
STM32F103x8, STM32F103xB
Note
and R
Table
Table 46: ADC
Table 24: HSI oscillator
Power supply
5,
PD
PU
44.
Note
corrected.
retention, typical
min and max values
min and max values
7,
Electrostatic
Note 9
modified.
schemes.
and
Static
and