STM32F103R8H7 STMicroelectronics, STM32F103R8H7 Datasheet - Page 81
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STM32F103R8H7
Manufacturer Part Number
STM32F103R8H7
Description
MCU 32BIT 64K FLASH 64BGA
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103R8H6.pdf
(99 pages)
Specifications of STM32F103R8H7
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
64-LFBGA
Processor Series
STM32F103x
Core
ARM Cortex M3
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ST-LINK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103R8H7
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM32F103x8, STM32F103xB
Figure 44. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
1. Drawing is not to scale.
Table 53.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
N (number of balls)
Symbol
outline
LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
mechanical data
0.270
0.45
9.85
9.85
Min
Doc ID 13587 Rev 13
millimeters
1.085
10.00
10.00
0.30
0.50
7.20
7.20
0.80
1.40
Typ
1.700
10.15
10.15
0.80
0.55
Max
0.12
0.15
0.08
100
0.0106
0.0177
0.3878
0.3878
Min
Package characteristics
inches
0.0427
0.0118
0.0197
0.3937
0.2835
0.3937
0.2835
0.0315
0.0551
Typ
(1)
0.0669
0.0315
0.0217
0.3996
0.3996
0.0047
0.0059
0.0031
Max
81/99