STM32F103R8H7 STMicroelectronics, STM32F103R8H7 Datasheet - Page 85

• Manufacturer Part Number: STM32F103R8H7
• Description: MCU 32BIT 64K FLASH 64BGA
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103R8H7

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 20K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-LFBGA
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ST-LINK
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

STM32F103x8, STM32F103xB
Figure 50. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline
1. Drawing is not to scale.
Table 56.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
Symbol
Seating
plane
TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
0.150
0.250
4.850
4.850
Min
C
A4
millimeters
A1
A3
A2
A
Doc ID 13587 Rev 13
0.785
0.200
0.300
5.000
3.500
5.000
3.500
0.500
0.750
0.080
0.150
0.050
Typ
B
H
G
F
E
D
C
B
A
A1 ball pad corner
e
1.200
0.600
0.350
5.150
5.150
Max
1
2
3
4
Bottom view
D
D1
5
0.0059
0.0098
0.1909
0.1909
Min
Øb (64 balls)
6
7
F
8
Package characteristics
inches
0.0309
0.0079
0.0118
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
0.0031
0.0059
0.0020
Typ
F
e
E1
(1)
ME_R8
E
A
0.0472
0.0236
0.0138
0.2028
0.2028
Max
85/99