DF2372RVFQ34V Renesas Electronics America, DF2372RVFQ34V Datasheet - Page 67

• Manufacturer Part Number: DF2372RVFQ34V
• Description: IC H8S/2372 MCU FLASH 144LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2372RVFQ34V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 34MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• For Use With: YLCDRSK2378 - KIT DEV EVAL H8S/2378 LCDYR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 26.20 Bus Timing (1) ...................................................................................................... 1041
Table 26.21 Bus Timing (2) ...................................................................................................... 1043
Table 26.22 DMAC and EXDMAC Timing ............................................................................. 1045
Table 26.23 Timing of On-Chip Peripheral Modules................................................................ 1046
Table 26.24 A/D Conversion Characteristics ............................................................................ 1048
Table 26.25 D/A Conversion Characteristics ............................................................................ 1048
Table 26.26 Flash Memory Characteristics (0.18-μm F-ZTAT Version) ................................. 1049
Table 26.27 Absolute Maximum Ratings.................................................................................. 1050
Table 26.28 DC Characteristics................................................................................................. 1051
Table 26.29 DC Characteristics................................................................................................. 1052
Table 26.30 Permissible Output Currents ................................................................................. 1053
Table 26.31 Clock Timing......................................................................................................... 1054
Table 26.32 Control Signal Timing........................................................................................... 1055
Table 26.33 Bus Timing (1) ...................................................................................................... 1056
Table 26.34 Bus Timing (2) ...................................................................................................... 1058
Table 26.35 DMAC and EXDMAC Timing ............................................................................. 1060
Table 26.36 Timing of On-Chip Peripheral Modules................................................................ 1061
Table 26.37 A/D Conversion Characteristics ............................................................................ 1063
Table 26.38 D/A Conversion Characteristics ............................................................................ 1063
Table 26.39 Flash Memory Characteristics (0.18-μm F-ZTAT Version) (512 kbytes) ............ 1064
Table 26.40 Flash Memory Characteristics (0.18-μm F-ZTAT Version) (384 kbytes) ............ 1065
Table 26.41 Flash Memory Characteristics (0.18-μm F-ZTAT Version) (256 kbytes) ............ 1066
Appendix
........................................................................................................1095
Table D.1
Execution State of Instructions.............................................................................. 1110
Rev.7.00 Mar. 18, 2009 page lxv of lxvi
REJ09B0109-0700