DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 343

MCU 3V 256K 100-TQFP

DF2170VTE33

Manufacturer Part Number
DF2170VTE33
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2170VTE33
HD64F2170VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
and clear TDRE flag in SSR to 0
Write transmit data to TDR
Read TDRE flag in SSR
Read TEND flag in SSR
Clear TE bit in SCR to 0
Start of transmission
All data transmitted?
Initialization
TDRE = 1?
TEND = 1?
Figure 11.6 Sample Serial Transmission Flowchart
<End>
Yes
Yes
Yes
No
No
No
[1]
[2]
[3]
[1] SCI initialization:
[2] SCI status check and transmit data
[3] Serial transmission continuation
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1, a frame
of 1s is output, and transmission is
enabled.
write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR and clear the
TDRE flag to 0.
procedure:
To continue serial transmission,
read 1 from the TDRE flag to
confirm that writing is possible,
then write data to TDR, and then
clear the TDRE flag to 0.
Rev. 2.00, 03/04, page 309 of 534

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