DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 426

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

Table 14.5 Parameters and Target Modes
Note:
Rev. 2.00, 03/04, page 392 of 534
Name of
Parameter
Download pass
and fail result
Flash pass and fail
result
Flash
programming/
erasing frequency
control
Flash multipurpose
address area
Flash multipurpose
data destination
area
Flash erase block
select
*
A single byte of the start address to download an on-chip program, which is specified by
FTDAR
Abbrevia-
tion
DPFR
FPFR
FPEFEQ
FMPAR
FMPDR
FEBS
Down
Load





Initializa-
tion




Program-
ming



Erasure




R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial
Value
Undefined
Undefined
Undefined
Undefined
Undefined
Undefined
Alloca-
tion
On-chip
RAM*
R0L of
CPU
R0 of
CPU
On-chip
RAM
On-chip
RAM
R0L of
CPU