DF2170VTE33 Renesas Electronics America, DF2170VTE33 Datasheet - Page 501

• Manufacturer Part Number: DF2170VTE33
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2170VTE33; HD64F2170VTE33

15.3
15.3.1
Since various characteristics related to the resonator are closely linked to the user's board design,
thorough evaluation is necessary on the user's part, using the resonator connection examples
shown in this section as a guide. As the parameters for the oscillation circuit will depend on the
floating capacitance of the resonator and the user board, the parameters should be determined in
consultation with the resonator manufacturer. The design must ensure that a voltage exceeding the
maximum rating is not applied to the resonator pin.
15.3.2
When using the crystal resonator, place the crystal resonator and its load capacitors as close as
possible to the XTAL and EXTAL pins. Other signal lines should be routed away from the
oscillation circuit to prevent induction from interfering with correct oscillation. See figure 15.7.
15.3.3
This LSI may oscillate itself on some kHz frequency even if a crystal resonator is not connected to
the EXTAL pin or XTAL pin, or the external clock is not input. Therefore, make sure this LSI is
working on the correct frequency before use.
Usage Notes
Notes on Resonator
Notes on Board Design
Note on confirming the operation
Figure 15.7 Note on Board Design for Oscillation Circuit
Avoid
C
C
L2
L1
Signal A Signal B
XTAL
EXTAL
This LSI
Rev. 2.00, 03/04, page 467 of 534