AT91SAM7SE512-AU Atmel, AT91SAM7SE512-AU Datasheet - Page 220

IC ARM7 MCU FLASH 512K 128-LQFP

AT91SAM7SE512-AU

Manufacturer Part Number
AT91SAM7SE512-AU
Description
IC ARM7 MCU FLASH 512K 128-LQFP
Manufacturer
Atmel
Series
AT91SAMr
Datasheets

Specifications of AT91SAM7SE512-AU

Core Processor
ARM7
Core Size
16/32-Bit
Speed
55MHz
Connectivity
EBI/EMI, I²C, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
88
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP
Cpu Family
91S
Device Core
ARM7TDMI
Device Core Size
32b
Frequency (max)
55MHz
Interface Type
EBI/SPI/TWI/USART
Total Internal Ram Size
32KB
# I/os (max)
88
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
1.95/3.6V
Operating Supply Voltage (min)
1.65/3V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
128
Package Type
LQFP
No. Of I/o's
88
Ram Memory Size
32KB
Cpu Speed
48MHz
No. Of Timers
3
No. Of Pwm Channels
4
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Processor Series
AT91SAMx
Core
ARM7TDMI
Data Bus Width
32 bit
Data Ram Size
32 KB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Operating Supply Voltage
1.8 V to 3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, KSK-AT91SAM7S-PL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM7SE-EK
Minimum Operating Temperature
- 40 C
For Use With
AT91SAM7SE-EK - EVAL BOARD FOR AT91SAM7SEAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

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24.3
24.3.1
24.3.2
220
Functional Description
SAM7SE512/256/32 Preliminary
Write Access
Read Access
A page in NAND Flash and SmartMedia memories contains an area for main data and an addi-
tional area used for redundancy (ECC). The page is organized in 8-bit or 16-bit words. The page
size corresponds to the number of words in the main area plus the number of words in the extra
area used for redundancy.
The only configuration required for ECC is the NAND Flash or the SmartMedia page size
(528/1056/2112/4224). Page size is configured setting the PAGESIZE field in the ECC Mode
Register (ECC_MR).
ECC is automatically computed as soon as a read (00h)/write (80h) command to the NAND
Flash or the SmartMedia is detected. Read and write access must start at a page boundary.
ECC results are available as soon as the counter reaches the end of the main area. Values in
the ECC Parity Register (ECC_PR) and ECC NParity Register (ECC_NPR) are then valid and
locked until a new start condition occurs (read/write command followed by address cycles).
Once the flash memory page is written, the computed ECC code is available in the ECC Parity
Error (ECC_PR) and ECC_NParity Error (ECC_NPR) registers. The ECC code value must be
written by the software application in the extra area used for redundancy.
After reading the whole data in the main area, the application must perform read accesses to the
extra area where ECC code has been previously stored. Error detection is automatically per-
formed by the ECC controller. Please note that it is mandatory to read consecutively the entire
main area and the locations where Parity and NParity values have been previously stored to let
the ECC controller perform error detection.
The application can check the ECC Status Register (ECC_SR) for any detected errors.
It is up to the application to correct any detected error. ECC computation can detect four differ-
ent circumstances:
ECC Status Register, ECC Parity Register and ECC NParity Register are cleared when a
read/write command is detected or a software reset is performed.
For Single-bit Error Correction and Double-bit Error Detection (SEC-DED) hsiao code is used.
32-bit ECC is generated in order to perform one bit correction per 512/1024/2048/4096 8- or 16-
• No error: XOR between the ECC computation and the ECC code stored at the end of the
• Recoverable error: Only the RECERR flag in the ECC Status register (ECC_SR) is set. The
• ECC error: The ECCERR flag in the ECC Status Register is set. An error has been detected
• Non correctable error: The MULERR flag in the ECC Status Register is set. Several
NAND Flash or SmartMedia page is equal to 0. No error flags in the ECC Status Register
(ECC_SR).
corrupted word offset in the read page is defined by the WORDADDR field in the ECC Parity
Register (ECC_PR). The corrupted bit position in the concerned word is defined in the
BITADDR field in the ECC Parity Register (ECC_PR).
in the ECC code stored in the Flash memory. The position of the corrupted bit can be found
by the application performing an XOR between the Parity and the NParity contained in the
ECC code stored in the flash memory.
unrecoverable errors have been detected in the flash memory page.
6222F–ATARM–14-Jan-11

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