AT91SAM7SE512-AU Atmel, AT91SAM7SE512-AU Datasheet - Page 383

IC ARM7 MCU FLASH 512K 128-LQFP

AT91SAM7SE512-AU

Manufacturer Part Number
AT91SAM7SE512-AU
Description
IC ARM7 MCU FLASH 512K 128-LQFP
Manufacturer
Atmel
Series
AT91SAMr
Datasheets

Specifications of AT91SAM7SE512-AU

Core Processor
ARM7
Core Size
16/32-Bit
Speed
55MHz
Connectivity
EBI/EMI, I²C, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
88
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP
Cpu Family
91S
Device Core
ARM7TDMI
Device Core Size
32b
Frequency (max)
55MHz
Interface Type
EBI/SPI/TWI/USART
Total Internal Ram Size
32KB
# I/os (max)
88
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
1.95/3.6V
Operating Supply Voltage (min)
1.65/3V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
128
Package Type
LQFP
No. Of I/o's
88
Ram Memory Size
32KB
Cpu Speed
48MHz
No. Of Timers
3
No. Of Pwm Channels
4
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Processor Series
AT91SAMx
Core
ARM7TDMI
Data Bus Width
32 bit
Data Ram Size
32 KB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Operating Supply Voltage
1.8 V to 3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, KSK-AT91SAM7S-PL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM7SE-EK
Minimum Operating Temperature
- 40 C
For Use With
AT91SAM7SE-EK - EVAL BOARD FOR AT91SAM7SEAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

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TXRDY used in Slave mode:
0 = As soon as data is written in the TWI_THR, until this data has been transmitted and acknowledged (ACK or NACK).
1 = It indicates that the TWI_THR is empty and that data has been transmitted and acknowledged.
If TXRDY is high and if a NACK has been detected, the transmission will be stopped. Thus when TRDY = NACK = 1, the
programmer must not fill TWI_THR to avoid losing it.
TXRDY behavior in Slave mode can be seen in
page 373
• SVREAD: Slave Read (automatically set / reset)
This bit is only used in Slave mode. When SVACC is low (no Slave access has been detected) SVREAD is irrelevant.
0 = Indicates that a write access is performed by a Master.
1 = Indicates that a read access is performed by a Master.
SVREAD behavior can be seen in
Figure 32-30 on page
• SVACC: Slave Access (automatically set / reset)
This bit is only used in Slave mode.
0 = TWI is not addressed. SVACC is automatically cleared after a NACK or a STOP condition is detected.
1 = Indicates that the address decoding sequence has matched (A Master has sent SADR). SVACC remains high until a
NACK or a STOP condition is detected.
SVACC behavior can be seen in
ure 32-30 on page
• GACC: General Call Access (clear on read)
This bit is only used in Slave mode.
0 = No General Call has been detected.
1 = A General Call has been detected. After the detection of General Call, the programmer decoded the commands that fol-
low and the programming sequence.
GACC behavior can be seen in
• OVRE: Overrun Error (clear on read)
This bit is only used in Master mode.
0 = TWI_RHR has not been loaded while RXRDY was set
1 = TWI_RHR has been loaded while RXRDY was set. Reset by read in TWI_SR when TXCOMP is set.
• NACK: Not Acknowledged (clear on read)
NACK used in Master mode:
0 = Each data byte has been correctly received by the far-end side TWI slave component.
1 = A data byte has not been acknowledged by the slave component. Set at the same time as TXCOMP.
6222F–ATARM–14-Jan-11
and
Figure 32-30 on page
373.
373.
Figure 32-26 on page
Figure 32-24 on page
Figure 32-24 on page
373.
Figure 32-24 on page
370.
369,
369,
Figure 32-25 on page
SAM7SE512/256/32 Preliminary
Figure 32-25 on page
369,
Figure 32-27 on page
369,
369,
Figure 32-29 on page 373
Figure 32-29 on page 373
371,
Figure 32-29 on
and
Fig-
and
383

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