ATMEGA2560R231-CU Atmel, ATMEGA2560R231-CU Datasheet - Page 4

• Manufacturer Part Number: ATMEGA2560R231-CU
• Description: BUNDLE ATMEGA2560/RF231 PBGA
• Manufacturer: Atmel

Specifications of ATMEGA2560R231-CU

• Frequency: 2.4GHz
• Modulation Or Protocol: 802.15.4 Zigbee, 6LoWPAN, RF4CE, SP100, WirelessHART™, ISM
• Data Interface: PCB, Surface Mount
• Memory Size: 256kB Flash, 4kB EEPROM, 8kB RAM
• Antenna Connector: PCB, Surface Mount
• Package / Case: 100-CBGA and 32-QFN
• Processor Series: ATMEGA256x
• Core: AVR8
• Data Bus Width: 8 bit
• Program Memory Type: Flash
• Program Memory Size: 256 KB
• Data Ram Size: 8 KB
• Development Tools By Supplier: ATAVRRZ541, ATAVRRAVEN, ATAVRRZRAVEN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Power - Output: -
• Operating Temperature: -
• Applications: -
• Sensitivity: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Lead Free Status / Rohs Status: Details

Figure 1-3.
2549M–AVR–09/10
(RXD0/ PCINT8 /PDI) PE0
(ICP3/ CLKO /INT7) PE7
(OC2A/ PCINT4 ) PB4
(MOSI/ PCINT2 ) PB2
(MISO/ PCINT3 ) PB3
(OC1A/ PCINT5 ) PB5
(OC1B/ PCINT6 ) PB6
(SCK/ PCINT1 ) PB1
(OC3A/AIN1) PE3
(OC3C/INT5) PE5
(SS/ PCINT0 ) PB0
(OC3B/INT4) PE4
(XCK0/AIN0) PE2
(TXD0/PDO) PE1
(T3/INT6) PE6
Pinout ATmega1281/2561
(OC0B) PG5
Note:
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
The large center pad underneath the QFN/MLF package is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
INDEX CORNER
ATmega640/1280/1281/2560/2561
ATmega1281/2561
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PG2 (ALE)
PC7 (A15 )
PC6 (A14)
PC5 (A13)
PC4 (A12)
PC3 (A11)
PC2 (A10)
PC1 (A9)
PC0 (A8)
PG1 (RD)
PG0 (WR)
4