MCIMX286CVM4B Freescale Semiconductor, MCIMX286CVM4B Datasheet

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MCIMX286CVM4B

Manufacturer Part Number
MCIMX286CVM4B
Description
IC MPU I.MX286 289MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX28r

Specifications of MCIMX286CVM4B

Core Processor
ARM9
Core Size
32-Bit
Speed
454MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Program Memory Size
128KB (32K x 32)
Program Memory Type
Mask ROM
Ram Size
32K x 32
Voltage - Supply (vcc/vdd)
1.25 V ~ 5.25 V
Data Converters
A/D 17x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
289-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX286CVM4B
Manufacturer:
NXP
Quantity:
113
Freescale Semiconductor
Data Sheet: Advance Information
i.MX28 Applications
Processor Data Sheet for
Consumer Products
Silicon Version 1.2
1
The i.MX28 is a low-power, high-performance
applications processor optimized for the general
embedded industrial and consumer
marketsindustrial and consumer markets.The core
of the i.MX28 is Freescale's fast, proven,
power-efficient implementation of the
ARM926EJ-S™ core, with speeds of up to
454 MHz.
The device is suitable for a wide range of
applications, including the following:
© Freescale Semiconductor, Inc., 2010. All rights reserved.
Introduction
Human-machine interface (HMI) panels:
industrial, home
Industrial drive, PLC, I/O control display,
factory robotics display, graphical remote
controls
Handheld scanners and printers
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
4. Package Information and Contact Assignment . . . . . . . 59
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
1.1.
1.2.
1.3.
2.1.
3.1.
3.2.
3.3.
3.4.
4.1.
4.2.
4.3.
4.4.
4.5.
4.6.
See
Device Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering Information & Functional Part Differences 3
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Special Signal Considerations . . . . . . . . . . . . . . . 10
i.MX28 Device-Level Conditions . . . . . . . . . . . . . . 11
I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 19
I/O AC Timing and Parameters . . . . . . . . . . . . . . . 23
Module Timing and Electrical Parameters . . . . . . 27
289-Ball MAPBGA—Case 14 x 14 mm,
0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Ground, Power, Sense, and Reference Contact
Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Signal Contact Assignments . . . . . . . . . . . . . . . . . 61
i.MX287 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 64
i.MX286 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 65
i.MX283 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 1 on page 3
Case 5284 14 x 14 mm, 0.8 mm Pitch
Document Number: IMX28CEC
Ordering Information
Package Information
i.MX28
Plastic package
Contents
for ordering information.
Rev. 0, 09/2010

Related parts for MCIMX286CVM4B

MCIMX286CVM4B Summary of contents

Page 1

... Industrial drive, PLC, I/O control display, factory robotics display, graphical remote controls • Handheld scanners and printers © Freescale Semiconductor, Inc., 2010. All rights reserved. Document Number: IMX28CEC Rev. 0, 09/2010 i.MX28 Package Information Plastic package Case 5284 mm, 0.8 mm Pitch ...

Page 2

... One USB2.0 host controller and PHY • LCD controller 24-bit RGB (DOTCK) modes and 24-bit system-mode • Pixel-processing pipeline (PXP) supports full path from color-space conversion, scaling, alpha-blending to rotation without intermediate memory access. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev Freescale Semiconductor ...

Page 3

... Ordering Information & Functional Part Differences Table 1 provides the ordering information for the i.MX28. Part Number Projected Temperature Range (°C) MCIMX283DVM4B MCIMX283CVM4B MCIMX286DVM4B MCIMX286CVM4B MCIMX287CVM4B i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 1. Ordering Information – mm, 0.8 mm pitch, MAPBGA-289 – mm, 0.8 mm pitch, MAPBGA-289 – ...

Page 4

... Applications Processor Data Sheet for Consumer Products, Rev Table 2. i.MX28 Functional Differences i.MX286 Yes Yes Yes Yes x1 x1 — — — OTG HS with HS PHY x1 HS Host with HS PHY — Yes Yes Yes i.MX287 Yes Yes x2 Yes OTG HS with HS PHY x1 HS Host with HS PHY Yes Yes Freescale Semiconductor ...

Page 5

... External Memory Interface (EMI) (1.5 V LV-DDR2, 1.8 V DDR2, 1.8 V LP-DDR1) General-Purpose Media Interface (GPMI): • NAND data width • Number of external NANDs supported i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor USB Host Cellular USB FS/HS Connectivity Host/Device USB PHY ...

Page 6

... MHz specified by the TIA/EIA-232-F standard and previous Freescale UART modules. 16-byte FIFO on Tx and 16-byte FIFO on Rx supporting auto-baud detection BGA289 5 dedicated / 8 with muxing 4 dedicated / 5 with muxing 3 dedicated / 4 with muxing 1 dedicated / 2 with muxing bits Yes Yes 2 MACs with switch 2 Brief Description Freescale Semiconductor ...

Page 7

... Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Brief Description The Bose, Ray-Chaudhuri, Hocquenghem (BCH) Encoder and Decoder module is capable of correcting from single bit errors within a block of data no larger than about 900 bytes (512 bytes is typical) in applications such as protecting data and resources stored on modern NAND flash devices ...

Page 8

... The on-chip one-time-programmable (OCOTP) ROM serves the functions of hardware and software capability bits, Freescale operations and unique-ID, the customer-programmable cryptography key, and storage of various ROM configuration bits. Used for general purpose input/output to external ICs. Each GPIO bank supports 32 bits of I/ Freescale Semiconductor ...

Page 9

... SPDIF SPDIF Connectivity peripherals i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Brief Description The i.MX28 integrates a comprehensive power supply subsystem, including the following features: • One integrated DC-DC converter that supports Li-Ion battery. • Four linear regulators directly power the supply rails from 5-V. ...

Page 10

... The integrated PHYs provide a standard UTM interface. The USB_DP and USB_DN pins connect directly to a USB connector. Table 5. The package contact assignment is found in Assignment.” Signal descriptions are provided in the reference manual. Table 5. Signal Considerations Descriptions Brief Description Section 4, Freescale Semiconductor ...

Page 11

... Source Pin 1 PSWITCH Analog Supply Voltage Digital Core Supply Voltage Non-EMI Digital I/O Supply i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 5. Signal Considerations (continued) Descriptions CAUTION Table 7 may cause permanent Table 6. DC Absolute Maximum Ratings ...

Page 12

... Applications Processor Data Sheet for Consumer Products, Rev Symbol V DDIO.EMI DCDC_BATT 3 Table 7. Electrostatic Discharge Immunity Min. Max. –0.3 3.63 –0.3 BATT — –0.3 VDDIO+0.3 — –0.3 3.63 — –0.3 VDDIO+0.3 — –40 125 Tested Level 2 kV 500 V Freescale Semiconductor Units ° C ...

Page 13

... To ensure that battery charging does not occur outside the recommended temperature range, the system ambient temperature may be monitored by connecting a thermistor to the LRADC0 or LRADC6 pin on the i.MX28. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Symbol 1, 2 ...

Page 14

... Table 11. PSWITCH Input Characteristics HW_PWR_STS_PSWITCH 0x00 0x01 0x11 Table 12. DC Characteristics Min — ≤ Θ (MAX Min Typ Max >1 — — Min Max 0.00 0.30 0.65 1.50 (1.1 * VDDXTAL) + 2.45 0.58 Typ Max TBD — Freescale Semiconductor ) where: D Units MΩ Units Units mW ...

Page 15

... Load Current + V Load Current + V DDIO DDM (V Load Current + V Load Current) < V DDA DDD 4 DCDC Double FETs Enabled, Inductor Value = 15 μH. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 13. Power Supply Characteristics DDM DDD 3. 4.75 V) DD5V 3. ...

Page 16

... HW_ HW_ / clk_emi CLKCTRL CLKCTRL Frequency EMI_ FRAC_ V (MHz) DIV_EMI EMIFRAC 1 130. 130. 130. 160. 205. 205. HW_CLKCTRL CPUCLK / clk_p Frequency max (MHz TBD TBD TBD TBD Freescale Semiconductor Supported DRAM DDR2 mDDR DDR2 mDDR DDR2 mDDR DDR2 mDDR DDR2 mDDR ...

Page 17

... Interface Frequency Limits Table 20 provides information for interface frequency limits. Parameter JTAG: TCK Frequency of Operation OSC24M_XTAL Oscillator OSC32K_XTAL Oscillator i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor HW_DIGCTRL 1 (V) ARMCACHE Minimum VDDD ...

Page 18

... Table 21. Power Mode Settings Deep-Sleep Standby Off Off Off Off Off Off Off Off 13.5uA TBD 30uA TBD TBD TBD TBD TBD Run (300 MHz) Run (454 MHz) Active@300 MHz Active@454 MHz TBD TBD TBD TBD TBD TBD TBD TBD Freescale Semiconductor ...

Page 19

... Input voltage high (dc) Input voltage low (dc) Output voltage high (dc) Output voltage low (dc) Output source current (dc) LVDDR2 Mode i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor At lease 100ms Figure 2. RESETN Timing NOTE Table 22. EMI Digital Pin DC Characteristics Symbol Min. ...

Page 20

... Medium TBD High TBD 1, 2 Max Load Max. Units TBD mA TBD mA TBD mA TBD mA TBD mA TBD mA TBD mA TBD mA TBD mA Typ. (Ω) Max. (Ω) TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Pad Voltage 1.8 V 1.8 V 1.5 V Freescale Semiconductor ...

Page 21

... Output source current (dc) gpio_clk 1 Output sink current (dc) gpio_clk 2 10-K pull-up resistance 2 47-K pull-up resistance i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Symbol Min VDDD 1.25 VDDIO33 3 VIH 2 VIL — 0.8 × VDDIO VOH VOL — ...

Page 22

... VDDIO18 VDDIO18 0.2 × VDDIO18 — 0.9 * VDDIO18 — 0.1 × VDDIO18 — TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Units KΩ KΩ Freescale Semiconductor ...

Page 23

... GPIO AC timing and parameters. Parameters Symbol Duty cycle Fduty Output pad transition tpr times (maximum drive) i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Testpoint Testpoint Figure 4. Output Pad Transition Waveform Table 27. Base GPIO Test Voltage Test Capacitance — — ...

Page 24

... Freescale Semiconductor Notes — — — — — — — — — — — — — — — — — — — ...

Page 25

... Output pad slew rate tps (maximum drive) Output pad slew rate tps (medium drive) i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 28. F-type GPIO Test Capacitance Min Rise/Fall Max Rise/Fall — — 1.7~1.9V 10pF 0.58 1 ...

Page 26

... Freescale Semiconductor Notes — — — — — — — — Notes — — — — — — — — — — ...

Page 27

... VDDA VDDD Expected plate resistance 1 There is no sample and hold circuit in LRADC only for DC input voltage or ones with very small slope. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 29. CLK-Type GPIO (continued) Min Rise/Fall 1.7~1.9V 10pF 1.50 1 ...

Page 28

... Table 32. USB PLL Specifications Test Conditions Min — — Min. Typ. Max. Unit — 0.5 — bits — — 2 MHz 1 sample cycles 0.5 — VDDA-0.5 V — TBD — — — TBD LSB — — TBD LSB Typ Max Unit — 10 µs Freescale Semiconductor ...

Page 29

... Cycle to cycle jitter 3.4.3 EMI AC Timing This section includes descriptions of the electrical specifications of EMI module which interfaces external DDR2 and Mobile-DDR1 (LP-DDR1) memory devices. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 33. Ethernet PLL Specifications Test Conditions Min — 45 — ...

Page 30

... Applications Processor Data Sheet for Consumer Products, Rev DDR2 DDR5 DDR4 DDR5 bank row Symbol tCK tCH 0.5 tCK tCL 0.5 tCK DDR3 DDR1 DDR5 bank column Min. Max. Unit 6 — ns 0.5 tCK ns –0.5 + 0.5 0.5 tCK ns –0.5 + 0.5 Freescale Semiconductor ...

Page 31

... DDR11 DQS falling edge from CK rising edge—hold time DDR12 DQS falling edge to CK rising edge—setup time DDR13 DQS output high pulse width i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Symbol tIS tIH DDR10 DDR13 d0 d1 Figure 6 ...

Page 32

... Symbol Min Max tDQSCK –0.5 0.5 tDQSQ 0.25 tCK 0.25 tCK –0.85 –0.5 tQH 0.25 tCK 0.25 tCK +0. Freescale Semiconductor Unit Unit ...

Page 33

... Ethernet transceiver. All signals are compatible with transceivers operating at a voltage of 3.3 V. The following subsections describe the timing for MII and RMII modes. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor DDR20 DDR22 DDR21 ...

Page 34

... There is no minimum frequency requirement. Additionally, the processor clock frequency must exceed twice the ENET0_TX_CLK frequency. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev Table 38 describes the timing parameters (M1–M4) shown Table 38. MII Receive Signal Timing 1 M4 Min. Max. Unit 5 — — ns 35% 65% ENET0_RX_CLK period 35% 65% ENET0_RX_CLK period Freescale Semiconductor ...

Page 35

... Table 40. MII Asynchronous Inputs Signal Timing ID Characteristic 1 M9 ENET0_CRS to ENET0_COL minimum pulse width 1 ENET0_COL has the same timing in 10-Mbit 7-wire interface mode. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 39 describes the timing parameters (M5–M8) shown Table 39. MII Transmit Signal Timing 1 Characteristic ...

Page 36

... ENET0_TX_EN, ENET0_TXD[1:0], ENET0_RXD[1:0] and ENET0_RX_ER. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev Table 41 describes the timing parameters (M10–M15) M14 M15 M10 M11 M12 M13 Min. 0 — 40% 40% Max. Unit — — ns — ns 60% ENET0_MDC period 60% ENET0_MDC period Freescale Semiconductor ...

Page 37

... The following timing specifications are given as a guide for a TPA that supports TRACECLK frequencies MHz. 3.4.5.1 TRACECLK Timing This section describes TRACECLK timings. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 42 describes the timing parameters (M16–M21) shown in the M16 M18 M19 ...

Page 38

... Applications Processor Data Sheet for Consumer Products, Rev Table 43 describes the timing parameters shown in the Table 43. MII Receive Signal Timing 1 Table 44. MII Transmit Signal Timing 1 Characteristic Min. Max. Unit 3 — — — — ns 12.5 — ns Min. Max. Unit 2 — — ns Freescale Semiconductor ...

Page 39

... Figure 16 through Figure 19 show the FlexCAN timing, including timing of the standby and shutdown signals. TXD t ONTXD V DIFF RXD i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 45. Tx Pin Characteristics Symbol Min — OL Table 46. Rx Pin Characteristics Symbol Min ...

Page 40

... The GPMI controller is a flexible interface NAND Flash controller with 8-bit data width 50-MBps I/O speed and individual chip select. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev 0.75 CC Bus Externally Driven 1.1V t SBRXDL t DRXDL OFFSHDN ONSHDN Bus Externally 0.5V Driven SHDNSB 0. Freescale Semiconductor ...

Page 41

... Figure 20. Command Latch Cycle Timing Diagram CLE CEn WE ALE IO[7:0] Figure 21. Address Latch Cycle Timing Diagram i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 47 describes the timing parameters (NF1–NF17) that are NF2 NF1 NF3 NF5 NF6 ...

Page 42

... Table 47. NFC Timing Parameters Timing T = GPMI Clock Cycle Symbol Min. Max. tCLS TBD — tCLH TBD — tCS TBD — tCH TBD — NF7 1 Example Timing for ≈ GPMI Clock MHz Min. Max. TBD — TBD — TBD — TBD — Freescale Semiconductor Unit ...

Page 43

... READ cycle time NF15 RE high hold time NF16 Data setup on read NF17 Data hold on read 1 The Flash clock maximum frequency is 100 MHz. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor 1 (continued) Timing T = GPMI Clock Cycle Symbol Min. Max. tWP TBD ...

Page 44

... Figure 24. LCD AC Output Timing Diagram DOTCK = T/2 – 1.97ns + 0.15*Cck – 0.19*Cd DOTCK = T/2 + 0.29ns + 0.09*Cd – 0.10*Cck DOTCK = T/2 – 2.09ns + 0.18*Cck – 0.19*Cd DOTCK = T/2 + 0.40ns + 0.09*Cd – 0.10*Cck lists the LCD module timing Description tDW = T – 1.45ns Freescale Semiconductor ...

Page 45

... No IC9) + data_setup_time (ID No IC7) = 1000 + 250 = 1250 ns (according to the standard-mode I specification) before the I2C_SCL line is released total capacitance of one bus line in pF. b i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor 2 C connection compliant with SDA and SCL signal timings module. ...

Page 46

... Applications Processor Data Sheet for Consumer Products, Rev describes the SJC timing parameters (SJ1–SJ13) indicated in the SJ1 SJ2 VM VIL Figure 26. Test Clock Input Timing Diagram SJ4 Input Data Valid SJ6 Output Data Valid SJ7 SJ6 Output Data Valid SJ2 VM SJ3 VIH SJ5 Freescale Semiconductor ...

Page 47

... SJ7 TCK low to output high impedance SJ8 TMS, TDI data set-up time SJ9 TMS, TDI data hold time i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor SJ8 Input Data Valid SJ10 Output Data Valid SJ11 SJ10 Output Data Valid SJ13 Figure 29 ...

Page 48

... Applications Processor Data Sheet for Consumer Products, Rev All Frequencies Min. — — 100 40 Table 51 lists the PWM timing characteristics Figure 30. PWM Timing Minimum — — — 15.77 Unit Max — ns — Maximum Unit 24MHz MHz — ns — ns 0.3 ns 0.3 ns 15.08 ns — ns Freescale Semiconductor ...

Page 49

... Clock low time 3a Clock fall time 3b Clock rise time 4a Output delay time 4b Output setup time PWMO = 30 pF PWM Source Clock PWM Output i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Figure 31. PWM Timing Minimum 1 0 6.813 24.432 — — — ...

Page 50

... Applications Processor Data Sheet for Consumer Products, Rev Minimum 1 24 20.99 21.01 — — — 15.92 SS1 SS5 SS4 SS6 SS11 SS8 SS10 SS13 Maximum Unit 24 MHz — ns — ns 0.3 ns 0.3 ns 15.23 ns — ns Table 54 describes the timing SS3 SS7 SS9 SS12 Freescale Semiconductor ...

Page 51

... SAIF receiver with internal clock. parameters (SS1–SS17) shown in the figure. SS2 BITCLK LRCLK SDATA0-2 i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 54. SAIF Transmitter Timing Parameter SS1 SS5 SS4 SS14 SS16 SS17 Figure 34 ...

Page 52

... Min. Max. 81.4 — 36.0 — — 6.0 36.0 — — 6.0 — 15.0 — 15.0 10.0 — 0.0 — Timing Parameter Range Min Max — 1.5 — 13.6 — 18.0 81.4 — 65.1 — 65.1 — Freescale Semiconductor Unit Unit ...

Page 53

... Clock Fall Time SSP Output / Card Inputs CMD, DAT (Reference to CLK) SD6 SSP Output Delay SSP Input / Card Outputs CMD, DAT (Reference to CLK) i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 57 lists the SD/MMC4.3 timing characteristics. SD4 SD2 SD5 ...

Page 54

... MMC4.4 timing characteristics. Be aware SCK SD2 DAT0 DAT1 ...... DAT7 SD3 SD4 DAT0 DAT1 ...... DAT7 Figure 37. MMC4.4 Timing Symbols ISU t IH Min Max Unit 2.5 — ns 2.5 — ns SD1 SD2 ...... ...... Min Max Unit 0 52 MHz – 2.5 — ns 2.5 — ns Freescale Semiconductor ...

Page 55

... MS4 SCK BS(CMD) DATA (Output) DATA (Input) Figure 39. MS Serial Transfer Mode Timing Diagram i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor show the timing of the Memory Stick. MS1 80% 50% 20% MS2 MS3 MS5 Figure 38. MS Clock Time Waveforms ...

Page 56

... MS11 MS13 MS15 Symbol tCLKc tCLKwh tCLKwl tCLKr tCLKf tBSsu tBSh tDsu tDh tDd Symbol tCLKc tCLKwh tCLKwl MS12 MS14 Min Max Units 50 — — — ns — — — — — — ns — Min Max Units 25 — — — ns Freescale Semiconductor ...

Page 57

... SS n lag time (CS hold time) CS7 MOSI setup time CS8 MOSI hold time CS9 MISO setup time CS10 MISO hold time i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Symbol tCLKr tCLKf tBSsu tBSh tDsu tDh tDd CS3 ...

Page 58

... Table 62 describes Possible Parity Bit Next Start STOP Bit 7 Bit 6 Par Bit Bit BIT UA1 UA1 Max baud_rate ref_clk Table 63 describes the Possible Parity Bit Next Start STOP Bit 6 Bit 7 Par Bit Bit BIT UA2 UA2 Freescale Semiconductor Units — ...

Page 59

... Datum A, the seating plane, is determined by the spherical crowns of the solder bumps. • Parallelism measurement shall exclude any effect of mark on top surface of package. i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 63. UART Receive Timing Parameters Symbol 1 t 1/F Rbit ) tolerance in each bit ...

Page 60

... MAPBGA package. Table 64. MAPBGA Power and Ground Contact Assignments Contact Name VDDA1 C13 VDDD G12,G11,F10,F11,K12,F12,G10 VDDIO18 G8,F9,F8,G9 VDDIO33 H8,J8,N3,G3,E6,J9,J10,A7,E16 VDDIO33_EMI N17 VDDIO_EMI P11,R13,N13,N15,G17,M12,M10,G13,M11,L13,G15 i.MX28 Applications Processor Data Sheet for Consumer Products, Rev Figure 44. i.MX28 Production Package zzxz Contact Assignment Freescale Semiconductor ...

Page 61

... M5 AUART3_TX L5 BATTERY A15 DCDC_BATT B15 DCDC_GND A17 DCDC_LN1 B17 DCDC_LP A16 i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Contact Assignment Table 65. MAPBGA Contact Assignments Contact Signal Name Assignment EMI_DQS1N J16 EMI_ODT0 R17 EMI_ODT1 T17 EMI_RASN R16 EMI_VREF0 ...

Page 62

... LRADC6 C14 PSWITCH A11 PWM0 K7 PWM1 L7 PWM2 K8 PWM3 E9 PWM4 E10 RESETN A14 RTC_XTALI D11 RTC_XTALO C11 SAIF0_BITCLK F7 SAIF0_LRCLK G6 SAIF0_MCLK G7 SAIF0_SDATA0 E7 SAIF1_SDATA0 E8 SPDIF D7 SSP0_CMD A4 SSP0_DATA0 B6 SSP0_DATA1 C6 SSP0_DATA2 D6 SSP0_DATA3 A5 SSP0_DATA4 B5 SSP0_DATA5 C5 SSP0_DATA6 D5 SSP0_DATA7 B4 SSP0_DETECT D10 SSP0_SCK A6 SSP1_CMD C1 SSP1_DATA0 D1 SSP1_DATA3 E1 SSP1_SCK B1 SSP2_MISO B3 Freescale Semiconductor ...

Page 63

... EMI_D15 F17 EMI_DDR_OPE K14 N EMI_DDR_OPE L15 N_FB EMI_DQM0 M15 EMI_DQM1 F15 EMI_DQS0 K17 EMI_DQS0N K16 EMI_DQS1 J17 i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Contact Signal Name Assignment JTAG_TRST D14 LCD_CS P5 LCD_D00 K2 LCD_D01 K3 LCD_D02 L2 LCD_D03 L3 LCD_D04 M2 LCD_D05 ...

Page 64

... D02 D05 I I VSSI VDDI EMI_ VDDI EMI_ EMI_ O_EM O_EM VREF O_EM RASN ODT0 VSSI EMI_ EMI_ EMI_ EMI_ EMI_ O_EM BA1 CKE WEN BA0 ODT1 I VSSI EMI_ EMI_ EMI_ EMI_ EMI_ O_EM A01 A10 A02 A00 CASN Freescale Semiconductor ...

Page 65

... LCD_ T D12 D13 D16 D19 D22 LCD_ LCD_ LCD_ LCD_ VSS U D14 D15 D18 D21 i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor SSP0 VDDI USB1 USB0 PSWI VSS _SCK O33 DP DM TCH SSP0 USB1 DEBU USB0 VSSA ...

Page 66

... D02 D05 I I VSSI VDDI EMI_ VDDI EMI_ EMI_ O_EM O_EM VREF O_EM RASN ODT0 VSSI EMI_ EMI_ EMI_ EMI_ EMI_ O_EM BA1 CKE WEN BA0 ODT1 I VSSI EMI_ EMI_ EMI_ EMI_ EMI_ O_EM A01 A10 A02 A00 CASN Freescale Semiconductor ...

Page 67

... Revision History Table 66 summarizes revisions to this document. Rev. Date 0 09/2010 Initial release i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor Table 66. Revision History Revision 67 ...

Page 68

... Applications Processor Data Sheet for Consumer Products, Rev Freescale Semiconductor ...

Page 69

... Applications Processor Data Sheet for Consumer Products, Rev. 0 Freescale Semiconductor 69 ...

Page 70

... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...

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