MCIMX286CVM4B Freescale Semiconductor, MCIMX286CVM4B Datasheet - Page 30
MCIMX286CVM4B
Manufacturer Part Number
MCIMX286CVM4B
Description
IC MPU I.MX286 289MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX28r
Datasheets
1.MCIMX283DVM4B.pdf
(70 pages)
2.MCIMX283DVM4B.pdf
(2 pages)
3.MCIMX283DVM4B.pdf
(2327 pages)
4.MCIMX283DVM4B.pdf
(20 pages)
Specifications of MCIMX286CVM4B
Core Processor
ARM9
Core Size
32-Bit
Speed
454MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Program Memory Size
128KB (32K x 32)
Program Memory Type
Mask ROM
Ram Size
32K x 32
Voltage - Supply (vcc/vdd)
1.25 V ~ 5.25 V
Data Converters
A/D 17x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
289-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
3.4.3.1
Figure 5
and Mobile-DDR1 memory devices.
30
DDR1
DDR2
DDR3
ID
and
EMI_CLKN
EMI_CLK
EMI_CE0N
EMI_RASN
EMI_CASN
EMI_WEN
EMI_ADDR
Table 34
EMI Command & Address AC Timing
CK cycle time
CK high level width
CK low level width
i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0
specify the timing related to the address and command pins that interfaces DDR2
DDR4
Description
DDR4
Table 34. EMI Command/Address AC Timing
Figure 5. EMI Command/Address AC Timing
bank
row
DDR5
DDR5
Symbol
tCH
tCK
tCL
DDR4
DDR2
0.5 tCK
0.5 tCK
Min.
–0.5
–0.5
6
column
DDR1
bank
Freescale Semiconductor
0.5 tCK
0.5 tCK
Max.
+ 0.5
+ 0.5
DDR3
—
DDR5
Unit
ns
ns
ns