ML610Q429-NNNTBZ03A7 Rohm Semiconductor, ML610Q429-NNNTBZ03A7 Datasheet - Page 432
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ML610Q429-NNNTBZ03A7
Manufacturer Part Number
ML610Q429-NNNTBZ03A7
Description
MCU 8BIT 48K FLASH 128-TQFP
Manufacturer
Rohm Semiconductor
Datasheets
1.ML610Q482P-NNNTB03A7.pdf
(20 pages)
2.ML610Q428-NNNTBZ03A7.pdf
(32 pages)
3.ML610Q428-NNNTBZ03A7.pdf
(434 pages)
Specifications of ML610Q429-NNNTBZ03A7
Core Processor
nX-U8/100
Core Size
8-Bit
Speed
4.2MHz
Connectivity
I²C, SSP, UART/USART
Peripherals
LCD, Melody Driver, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.1 V ~ 3.6 V
Data Converters
A/D 2x12b, 2x24b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 70°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ML610Q429-NNNTBZ03A7
Manufacturer:
Rohm
Quantity:
900
Company:
Part Number:
ML610Q429-NNNTBZ03A7
Manufacturer:
Rohm Semiconductor
Quantity:
10 000
- ML610Q482P-NNNTB03A7 PDF datasheet
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• Bias
[ ] 1/3 bias or [ ] 1/4 bias
• Duty
[ ] ML610Q428: 1/1 ~ 1/24 duty
[ ] ML610Q429: 1/1 ~ 1/8 duty
• COM/SEG
[ ] ML610Q428: 24COM x 58SEG
[ ] ML610Q429_BXX: 8COM x 64SEG (SEG63 to SEG0:SEGMENT PORT)
[ ] ML610Q429_CXX: 8COM x 56SEG (SEG63 to SEG56:OUTPUT PORT、SEG55 to SEG0:SEGMENT PORT)
[ ] ML610Q429_DXX: 8COM x 48SEG (SEG63 to SEG48:OUTPUT PORT、SEG47 to SEG0:SEGMENT PORT)
[ ] ML610Q429_EXX: 8COM x 40SEG (SEG63 to SEG40:OUTPUT PORT、SEG39 to SEG0:SEGMENT PORT)
[ ] ML610Q429_FXX: 8COM x 32SEG (SEG63 to SEG32:OUTPUT PORT、SEG31 to SEG0:SEGMENT PORT))
• External capacitor
(1/3 bias)
[ ] Ca=1uF(connected to VL1 pin), [ ] Cb=1uF(connected to VL2 pin),
[ ] Cd=1uF(connected to VL4 pin),
[ ] C12=1uF(connected between C1 and C2 pin), [ ] C34=1uF(connected between C3 and C4 pin)
(1/4 bias)
[ ] Ca=1uF(connected to VL1 pin), [ ] Cb=1uF(connected to VL2 pin),
[ ] Cc=1uF(connected to VL3 pin), [ ] Cd=1uF(connected to VL4 pin),
[ ] C12=1uF(connected between C1 and C2 pin), [ ] C34=1uF(connected between C3 and C4 pin)
Chapter 25 BLD (Battery Low Detector)
• Changing the threshold
[ ] Please select the threshold voltage when the BLD circuit is OFF.
Chapter 26 Power circuit
• External capacitor
[ ] CL0=1uF (connected to VDDL pin),
Chapter 27 On-chip debug
[ ] Supply 3.0V ~ 3.6V to VDD pin when programming (erasing and writing) the Flash ROM with Oki semiconductor
development tool uEASE.
[ ] Please do not apply LSIs being used for debugging to mass production.
[ ] Please validate the ROM code on your production board without Oki semiconductor development tool uEASE.
Appendix A SFR (Specific Function Registers)
• Initial data
[ ] Please confirm there are some SFRs have undefined initial value at reset (Refer to Appendix A in the user’s manual).
Appendix C Electrical Characteristics
• Operating temperature
[ ] -20’C to +70’C
• Operating voltage vs Operating frequency
[ ] Please confirm the operating conditions.
Chapter 24 LCD driver
[ ] +1.1V to +3.6V (0kHz to 36kHz: Low-speed crystal oscillation clock operation)
[ ] +1.3V to +3.6V (30kHz to 625kHz: Built-in RC oscillation clock operation)
[ ] +1.8V to +3.6V (30kHz to 4.2MHz: High-speed crystal/ceramic oscillation clock or built-in PLL oscillation clock)
XX: ROM code number
[ ] Cx =0.1uF (connected to VDDX pin)
E – 4
ML610Q428/ML610Q429 User’s Manual
Appendix E Check List
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