AC80566UC005DE S LB2C Intel, AC80566UC005DE S LB2C Datasheet - Page 65

• Manufacturer Part Number: AC80566UC005DE S LB2C
• Description: MPU, ATOM PROCESSOR, Z510, U-FCBGA
• Manufacturer: Intel
• Series: ATOM - Z5xxr

Specifications of AC80566UC005DE S LB2C

• Core Size: 32bit
• Program Memory Size: 512KB
• Cpu Speed: 400MHz
• Digital Ic Case Style: FCBGA
• No. Of Pins: 441
• Supply Voltage Range: 0.75V To 1.1V
• Operating Temperature Range: 0°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thermal Specifications and Design Considerations
5
Datasheet
Note: Trading thermal solutions also involves trading performance.
Thermal Specifications and
Design Considerations
The processor requires a thermal solution to maintain temperatures within operating
limits as set forth in Section 5.1. Any attempt to operate the processor outside these
operating limits may result in permanent damage to the processor and potentially
other components in the system. As processor technology changes, thermal
management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is critical to reliable, long-term system
operation. A complete thermal solution includes both component and system level
thermal management features. Component level thermal solutions include active or
passive heat spreaders or heat exchangers attached to the exposed processor die. The
solution should make firm contact to the die while maintaining processor mechanical
specifications such as pressure. A typical system level thermal solution may consist of
a system fan used to evacuate or pull air through the system in conjunction with a
multi-component heat spreader used to reduce the temperature of the processor and
other components while maintaining as uniform a skin temperature as possible.
Alternatively, the processor may be in a fan-less system, but would likely still use a
multi-component heat spreader.
To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should be designed such that the
processor remains within the minimum and maximum junction temperature (T
specifications at the corresponding thermal design power (TDP) value listed in
Table 16 and Table 17. Thermal solutions not designed to provide this level of thermal
capability may affect the long-term reliability of the processor and system.
Refer to the Intel Centrino Atom Platform Thermal Application Note document for
more details on processor and system level cooling approaches.
The maximum junction temperature is defined by an activation of the processor Intel
Thermal Monitor. Refer to Section 5.1.2 for more details. Analysis indicates that real
applications are unlikely to cause the processor to consume the theoretical maximum
power dissipation for sustained time periods. Intel recommends that complete thermal
solution designs target the TDP indicated in Table 16 and Table 17. The Intel Thermal
Monitor feature is designed to help protect the processor in the unlikely event that an
application exceeds the TDP recommendation for a sustained period of time. For more
details on the usage of this feature, refer to Section 5.1.2. In all cases the Intel
Thermal Monitor feature must be enabled for the processor to remain within
specification.
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