AC80566UC005DE S LB2C Intel, AC80566UC005DE S LB2C Datasheet - Page 9

• Manufacturer Part Number: AC80566UC005DE S LB2C
• Description: MPU, ATOM PROCESSOR, Z510, U-FCBGA
• Manufacturer: Intel
• Series: ATOM - Z5xxr

Specifications of AC80566UC005DE S LB2C

• Core Size: 32bit
• Program Memory Size: 512KB
• Cpu Speed: 400MHz
• Digital Ic Case Style: FCBGA
• No. Of Pins: 441
• Supply Voltage Range: 0.75V To 1.1V
• Operating Temperature Range: 0°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Introduction
1.3
Datasheet
Terminology
#
Front Side Bus
(FSB)
AGTL+
Intel® Burst
Performance
Technology
(Intel® BPT)
BFM
CMOS
Storage
Conditions
Enhanced Intel
SpeedStep®
Technology
Processor Core
Intel
Virtualization
Technology
TDP
V
VR
V
V
V
CC
SS
CC
CC
HFM
LFM
Term
A “#” symbol after a signal name refers to an active low signal, indicating
a signal is in the active state when driven to a low level. For example,
when RESET# is low, a reset has been requested. Conversely, when NMI
is high, a non-maskable interrupt has occurred. In the case of signals
where the name does not imply an active state but describes part of a
binary sequence (such as address or data), the “#” symbol implies that
the signal is inverted. For example, D[3:0] = “HLHL” refers to a hex ‘A’,
and D[3:0]# = “LHLH” also refers to a hex “A” (H= High logic level,
L= Low logic level).
Refers to the interface between the processor and system core logic (also
known as the Intel® SCH chipset components).
Advanced Gunning Transceiver Logic is used to refer to Assisted GTL+
signaling technology on some Intel processors.
Enables on-demand performance, without impacting or raising MID
thermal design point.
Burst Frequency Mode
Complementary Metal-Oxide Semiconductor
Refers to a non-operational state—the processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor landings should
not be connected to any supply voltages, or have any I/Os biased, or
receive any clocks. Upon exposure to “free air” (that is, unsealed
packaging or a device removed from packaging material) the processor
must be handled in accordance with moisture sensitivity labeling (MSL)
as indicated on the packaging material.
Technology that provides power management capabilities to low power
devices.
Processor core die with integrated L1 and L2 cache. All AC timing and
signal integrity specifications are at the pads of the processor core.
Processor virtualization which when used in conjunction with Virtual
Machine Monitor software enables multiple, robust independent software
environments inside a single platform.
Thermal Design Power
The processor core power supply.
Voltage Regulator
The processor ground
V
V
CC
CC
at Highest Frequency Mode (HFM)
at Lowest Frequency Mode (LFM)
Definition
9