ADSP-21160NCB-100 Analog Devices Inc, ADSP-21160NCB-100 Datasheet - Page 57

• Manufacturer Part Number: ADSP-21160NCB-100
• Description: IC,DSP,32-BIT,CMOS,BGA,400PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21160NCB-100

• Rohs Status: RoHS non-compliant
• Interface: Host Interface, Link Port, Serial Port
• Clock Rate: 100MHz
• Non-volatile Memory: External
• On-chip Ram: 512kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.90V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 400-BGA
• Package: 400BGA
• Numeric And Arithmetic Format: Floating-Point
• Maximum Speed: 100 MHz
• Ram Size: 512 KB
• Device Million Instructions Per Second: 100 MIPS

OUTLINE DIMENSIONS
The ADSP-21160x processors are available in a
27 mm
SURFACE-MOUNT DESIGN
The following table is provided as an aide to PCB design.
For industry-standard design recommendations, refer to
IPC-7351, Generic Requirements for Surface-Mount Design
and Land Pattern Standard.
Package
400-Ball Grid Array (PBGA)
27 mm, 400-ball PBGA lead-free package.
INDICATOR
BALL A1
2.49
2.32
2.15
Figure 42. 400-Ball Plastic Grid Array (PBGA) (B-400) Compliant to JEDEC Standards MS-034-BAL-2 (Dimensions in Millimeters)
Ball Attach Type
Solder Mask Defined (SMD)
TOP VIEW
27.20
27.00
26.80
SQ
Rev. B | Page 57 of 60 | February 2010
DETAIL A
Solder Mask Opening
0.63 mm diameter
24.13
BSC
SQ
BSC
1.27
SEATING
PLANE
0.60
0.55
0.50
20 18
19
BALL DIAMETER
17
16
0.90
0.75
0.60
15 13
ADSP-21160M/ADSP-21160N
14
BOTTOM VIEW
DETAIL A
12
11
10
Ball Pad Size
0.76 mm diameter
9
8
BALL A1 PAD CORNER
7
6
5
4
COPLANARITY
3
2
0.20 MAX
1
1.19
1.17
1.15
0.70
0.60
0.50
A
B
C
D
E
G
H
K
M
N
P
R
U
V
W
F
J
L
T
Y