EP2SGX90EF1152I4N Altera, EP2SGX90EF1152I4N Datasheet - Page 138

Stratix II GX

EP2SGX90EF1152I4N

Manufacturer Part Number
EP2SGX90EF1152I4N
Description
Stratix II GX
Manufacturer
Altera
Datasheet

Specifications of EP2SGX90EF1152I4N

Family Name
Stratix II GX
Number Of Logic Blocks/elements
90960
# I/os (max)
558
Frequency (max)
732.1MHz
Process Technology
SRAM
Operating Supply Voltage (typ)
1.2V
Logic Cells
90960
Ram Bits
4520448
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
1152
Package Type
FC-FBGA
Lead Free Status / Rohs Status
Compliant

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I/O Structure
2–130
Stratix II GX Device Handbook, Volume 1
Series termination without
calibration
Table 2–34. On-Chip Termination Support by I/O Banks (Part 1 of 2)
On-Chip Termination Support
On-Chip Termination
Stratix II GX devices provide differential (for the LVDS technology I/O
standard) and series on-chip termination to reduce reflections and
maintain signal integrity. On-chip termination simplifies board design by
minimizing the number of external termination resistors required.
Termination can be placed inside the package, eliminating small stubs
that can still lead to reflections.
Stratix II GX devices provide four types of termination:
Table 2–34
bank.
3.3-V LVTTL
3.3-V LVCMOS
2.5-V LVTTL
2.5-V LVCMOS
1.8-V LVTTL
1.8-V LVCMOS
1.5-V LVTTL
1.5-V LVCMOS
SSTL-2 class I and II
SSTL-18 class I
SSTL-18 class II
1.8-V HSTL class I
1.8-V HSTL class II
1.5-V HSTL class I
1.2-V HSTL
Differential termination (R
Series termination (R
Series termination (R
Parallel termination (R
I/O Standard Support
shows the Stratix II GX on-chip termination support per I/O
S
S
) without calibration
) with calibration
T
) with calibration
Top and Bottom Banks
D
)
(3, 4, 7, 8)
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Altera Corporation
Left Bank (1, 2)
October 2007
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