NDS332P Fairchild Semiconductor, NDS332P Datasheet - Page 6

• Manufacturer Part Number: NDS332P
• Description: MOSFET P-CH 20V 1A SSOT3
• Manufacturer: Fairchild Semiconductor

Specifications of NDS332P

• Fet Type: MOSFET P-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 300 mOhm @ 1.1A, 4.5V
• Drain To Source Voltage (vdss): 20V
• Current - Continuous Drain (id) @ 25° C: 1A
• Vgs(th) (max) @ Id: 1V @ 250µA
• Gate Charge (qg) @ Vgs: 5nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 195pF @ 10V
• Power - Max: 460mW
• Mounting Type: Surface Mount
• Package / Case: 3-SSOT, SuperSOT-3
• Configuration: Single
• Transistor Polarity: P-Channel
• Resistance Drain-source Rds (on): 0.3 Ohm @ 4.5 V
• Drain-source Breakdown Voltage: 20 V
• Gate-source Breakdown Voltage: +/- 8 V
• Continuous Drain Current: 1 A
• Power Dissipation: 500 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Continuous Drain Current Id: 1A
• Drain Source Voltage Vds: 20V
• On Resistance Rds(on): 410mohm
• Rds(on) Test Voltage Vgs: -4.5V
• Threshold Voltage Vgs Typ: -600mV
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NDS332PTR

Typical Electrical Characteristics
0.8
0.6
0.4
0.2
0.005
0.002
0.001
4
3
2
1
0
0.05
0.02
0.01
Figure 13. Transconductance Variation with
1
0
0
0.5
0.2
0.1
Steady-State Power Dissipation versus
0.0001
V
0
Figue 15. SuperSOT
1
DS
1b
1a
=- 5V
D = 0.5
0.02
0.01
0.05
-0.5
0.2
0.1
Drain Current and Temperature
Copper Mounting Pad Area.
Figure 17. Transient Thermal Response Curve.
Note : Characterization performed using the conditions described in note 1b. Transient thermal response will
Single Pulse
2oz COPPER MOUNTING PAD AREA (in )
0.1
change depending on the circuit board design.
-1
I , DRAIN CURRENT (A)
D
0.001
TM _
-1.5
0.2
3 Maximum
T = -55°C
J
125°C
25°C
-2
0.01
0.3
(continued)
4.5"x5" FR-4 Board
T = 25 C
Still Air
A
2
-2.5
.
o
0.4
-3
0.1
t , TIME (sec)
1
0.03
0.01
0.5
0.1
20
10
1.4
1.2
0.8
0.6
Figure 14. Maximum Safe Operating Area
5
2
1
0.1
1
0
Current versus Copper Mounting Pad Area
Figure 16. Maximum Steady-State Drain
1a
R
SINGLE PULSE
JA
0.2
V
1b
T
= See Note 1b
GS
A
1
= 25°C
= -2.7V
2oz COPPER MOUNTING PAD AREA (in )
-V
0.5
0.1
DS
, DRAIN-SOURCE VOLTAGE (V)
1
P(pk)
2
T - T
R
R
Duty Cycle, D = t /t
J
0.2
10
JA
JA
t
1
A
(t) = r(t) * R
= See Note 1b
t
= P * R
2
5
4.5"x5" FR-4 Board
T = 25 C
Still Air
V
10
A
GS
JA
1
= -2.7V
0.3
JA
(t)
2
2
o
20
100
.
NDS332PRev. E
.
50
0.4
300