This N-Channel logic Level MOSFETs are produced using Fairchild Semiconductor‘s advanced Power Trench® process that has been special tailored to minimize the on-state resistance and yet maintain superior switching performance
This N-Channel logic Level MOSFETs are produced using Fairchild Semiconductor‘s advanced Power Trench® process that has been special tailored to minimize the on-state resistance and yet maintain superior switching performance
This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced Power Trench® process that has been especially tailored to minimize the on-state resistance and yet maintain superior switching performance
... T =25 C unless otherwise noted A (Note 1a) (Note 1a) (Note 1b) (Note 1a) (Note 1) Reel Size Tape width 7’’ October 2001 = 4.5 V DS(ON 2.5 V DS(ON 120 1.8 V DS(ON Ratings Units 0.5 W 0.46 –55 to +150 C 250 C/W 75 C/W Quantity 8mm 3000 units FDN327N Rev C (W) ...
... MHz 4 GEN 4 0. determined by the user's board design 270°C/W when mounted on a minimum pad. 2.0% Min Typ Max Units mV 100 nA –100 nA 0.4 0.7 1.5 V –3 mV 120 55 103 423 6 4.5 6.3 nC 0.89 nC 0.95 nC 0.42 A 0.6 1.2 V (Note 2) FDN327N Rev C (W) ...
... V Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. 2.0V 2.5V 3.0V 3.5V 4. DRAIN CURRENT ( 125 GATE TO SOURCE VOLTAGE ( 125 -55 C 0.4 0.6 0.8 1 1.2 , BODY DIODE FORWARD VOLTAGE (V) SD FDN327N Rev C ( 1.4 ...
... Figure 10. Single Pulse Maximum 0.01 0 1MHz ISS C OSS DRAIN TO SOURCE VOLTAGE (V) DS SINGLE PULSE R = 270°C 25° 100 1000 t , TIME (sec) 1 Power Dissipation. R ( 270 °C/W JA P(pk ( Duty Cycle 100 FDN327N Rev C (W) 20 1000 ...
... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. ACEx™ FAST Bottomless™ FASTr™ FRFET™ CoolFET™ GlobalOptoisolator™ CROSSVOLT™ GTO™ DenseTrench™ ...