FDG312P Fairchild Semiconductor, FDG312P Datasheet
FDG312P
Specifications of FDG312P
Available stocks
Related parts for FDG312P
FDG312P Summary of contents
Page 1
... Compact industry standard SC70-6 surface mount package 25°C unless otherwise noted A Parameter (Note 1) (Note 1a) (Note 1b) (Note 1c) (Note 1) Device Reel Size FDG312P 7’’ February 1999 = 0. -4.5 V DS(on 0. -2.5 V. DS(on Ratings Units - -1 0.75 W 0.55 0.48 -55 to +150 C 260 C/W Tape Width Quantity 8mm 3000 units FDG312P Rev. C ...
Page 2
... Min Typ Max Units -20 V -19 mV 100 nA -100 nA -0.4 -0.9 -1.5 V 2.5 mV/ C 0.135 0.18 0.200 0.29 0.187 0. 3.8 S 330 3 0.8 nC 0.7 nC -0.6 A -0.83 -1 260 C/W when mounted on a minimum pad of 2oz copper. FDG312P Rev. C ...
Page 3
... SD Figure 6. Body Diode Forward Voltage Variation with Source Current -2.5V -3.0V -3.5V -4.0V -4. DRAIN CURRENT ( -0. 125° 25° GATE TO SOURCE VOLTAGE ( 125°C J 25°C -55°C 0.6 0.8 1 1.2 1.4 , BODY DIODE FORWARD VOLTAGE (V) and Temperature. FDG312P Rev. C ...
Page 4
... Thermal characterization performed using the conditions described in Note 1c. Transient themal response will change depending on the circuit board design. C iss C oss C rss 0 DRAIN TO SOURCE VOLTAGE (V) DS SINGLE PULSE 260 C 0.01 0 100 SINGLE PULS E TIME (SEC) Power Dissipation. R ( =260°C/W JA P(pk ( Duty Cycle 100 300 FDG312P Rev. C 1000 ...
Page 5
... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ CMOS FACT™ FACT Quiet Series™ FAST FASTr™ GTO™ ...