FDS4675 Fairchild Semiconductor, FDS4675 Datasheet - Page 2

MOSFET P-CH 40V 11A 8SOIC

FDS4675

Manufacturer Part Number
FDS4675
Description
MOSFET P-CH 40V 11A 8SOIC
Manufacturer
Fairchild Semiconductor
Series
PowerTrench®r
Datasheet

Specifications of FDS4675

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
13 mOhm @ 11A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
11A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
56nC @ 4.5V
Input Capacitance (ciss) @ Vds
4350pF @ 20V
Power - Max
1.2W
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FDS4675
FDS4675TR

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Notes:
1. R
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%
Electrical Characteristics
Symbol
Off Characteristics
BV
I
I
I
On Characteristics
V
R
I
g
Dynamic Characteristics
C
C
C
Switching Characteristics
t
t
t
t
Q
Q
Q
Drain–Source Diode Characteristics and Maximum Ratings
I
V
DSS
GSSF
GSSR
D(on)
S
the drain pins. R
d(on)
r
d(off)
f
FS
BV
V
DS(on)
iss
oss
rss
GS(th)
g
gs
gd
SD
JA
DSS
GS(th)
T
T
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
DSS
J
J
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
On–State Drain Current
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
Voltage
JC
is guaranteed by design while R
a) 50°C/W when
mounted on a 1in
pad of 2 oz copper
Parameter
(Note 2)
2
(Note 2)
CA
is determined by the user's board design.
V
I
V
V
V
V
I
V
V
V
V
V
V
f = 1.0 MHz
V
V
V
V
V
T
D
D
A
GS
DS
GS
GS
DS
GS
GS
GS
GS
DS
DS
DD
GS
DS
GS
GS
b) 105°C/W when
= –250 A, Referenced to 25 C
= –250 A, Referenced to 25 C
= 25°C unless otherwise noted
=–10 V, I
mounted on a .04 in
pad of 2 oz copper
= 0 V, I
= –32 V, V
= 20 V,
= –20 V
= V
= –10 V,
= –4.5 V,
= –10 V,
= –5 V,
= –20 V,
= –20 V,
= –4.5 V,
= –20 V,
= –4.5 V
= 0 V, I
Test Conditions
GS
, I
D
D
D
= –250 A
S
= –250 A
=–11 A, T
= –2.1 A
V
V
I
I
V
I
GS
DS
D
D
D
V
I
I
R
DS
D
D
2
= –11 A
= –9.5 A
GS
GEN
= –11 A,
DS
= –11 A
= –1 A,
= 0 V
= 0 V
= 0 V
= 0 V,
= –5 V
= 6
J
=125 C
(Note 2)
Min
–40
–25
–1
c) 125°C/W when mounted on a
minimum pad.
4350
Typ
–1.4
–0.7
–34
622
290
4.6
10
13
15
44
20
29
95
60
40
11
13
Max Units
–100
–2.1
–1.2
100
152
–1
–3
13
17
21
36
46
96
56
FDS4675 Rev C(W)
mV/ C
mV/ C
m
nA
nA
nC
nC
nC
pF
pF
pF
ns
ns
ns
ns
V
V
A
S
A
V
A

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