SI3200-G-GS Silicon Laboratories Inc, SI3200-G-GS Datasheet - Page 106

• Manufacturer Part Number: SI3200-G-GS
• Description: SLIC 2-CH 63dB 45mA 3.3V 6-Pin SMD
• Manufacturer: Silicon Laboratories Inc
• Series: ProSLIC®r

Specifications of SI3200-G-GS

• Package: 6SMD
• Number Of Channels Per Chip: 2
• Polarity Reversal: Yes
• Longitudinal Balanced: 63 dB
• Loop Current: 45 mA
• Minimum Operating Supply Voltage: 3.13 V
• Typical Operating Supply Voltage: 3.3 V
• Typical Supply Current: 0.11 mA
• Function: Subscriber Line Interface Concept (SLIC), CODEC
• Interface: GCI, PCM, SPI
• Number Of Circuits: 2
• Voltage - Supply: 3.3V, 5V
• Current - Supply: 110µA
• Power (watts): 941mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (3.9mm Width)
• Includes: Battery Switching, BORSCHT Functions, DTMF Generation and Decoding, FSK Tone Generation, Modem and Fax Tone Detection
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Si3220/25 Si3200/02
106
Pin #(s)
epad
12
13
14
15
16
Symbol
IRINGN
IRINGP
THERM
ITIPN
ITIPP
GND
Output
Input/
O
I
I
I
I
Description
Negative RING Current Control.
Connect to the IRINGN lead of the Si3220 or Si3225.
Positive RING Current Drive.
Connect to the IRINGP lead of the Si3220 or Si3225.
Thermal Sensor.
Connect to THERM pin of Si3220 or Si3225.
Negative TIP Current Control.
Connect to the ITIPN lead of the Si3220 or Si3225.
Positive TIP Current Control.
Connect to the ITIPP lead of the Si3220 or Si3225.
Exposed Die Paddle Ground.
For adequate thermal management, the exposed die paddle should be sol-
dered to a PCB pad that is connected to low-impedance inner and/or back-
side ground planes using multiple vias. See “7. Package Outline: 16-Pin
ESOIC” for PCB pad dimensions.
Rev. 1.3