MT48LC16M16A2P-75 L:D TR Micron Technology Inc, MT48LC16M16A2P-75 L:D TR Datasheet - Page 5

• Manufacturer Part Number: MT48LC16M16A2P-75 L:D TR
• Description: DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II T/R
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC16M16A2P-75 L:D TR

• Package: 54TSOP-II
• Density: 256 Mb
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Clock Rate: 133 MHz
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: 0 to 70 °C
• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 256M (16Mx16)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 54-TSOP II
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1191-2

List of Tables
Table 1: Address Table .................................................................................................................................... 1
Table 2: Key Timing Parameters ...................................................................................................................... 1
Table 3: 256Mb SDR Part Numbering ............................................................................................................... 2
Table 4: Pin and Ball Descriptions .................................................................................................................. 15
Table 5: Temperature Limits .......................................................................................................................... 19
Table 6: Thermal Impedance Simulated Values .............................................................................................. 20
Table 7: Absolute Maximum Ratings .............................................................................................................. 22
Table 8: DC Electrical Characteristics and Operating Conditions ..................................................................... 22
Table 9: Capacitance ..................................................................................................................................... 23
Table 10: I
Table 11: I
Table 12: Electrical Characteristics and Recommended AC Operating Conditions (-6A) ................................... 26
Table 13: Electrical Characteristics and Recommended AC Operating Conditions (-7E, -75) ............................. 27
Table 14: AC Functional Characteristics (-6A) ................................................................................................. 28
Table 15: AC Functional Characteristics (-7E, -75) .......................................................................................... 29
Table 16: Truth Table – Commands and DQM Operation ................................................................................ 32
Table 17: Truth Table – Current State Bank n, Command to Bank n ................................................................. 38
Table 18: Truth Table – Current State Bank n, Command to Bank m ................................................................ 40
Table 19: Truth Table – CKE .......................................................................................................................... 42
Table 20: Burst Definition Table .................................................................................................................... 49
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
DD
DD
Specifications and Conditions (-6A) ........................................................................................... 24
Specifications and Conditions (-7E, -75) .................................................................................... 24
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 SDRAM
© 1999 Micron Technology, Inc. All rights reserved.