CY8C5246AXI-038 Cypress Semiconductor Corp, CY8C5246AXI-038 Datasheet - Page 77
![no-image](/images/manufacturer_photos/0/1/179/cypress_semiconductor_corp_sml.jpg)
CY8C5246AXI-038
Manufacturer Part Number
CY8C5246AXI-038
Description
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY8C5246AXI-038.pdf
(85 pages)
Specifications of CY8C5246AXI-038
Lead Free Status / RoHS Status
Compliant
- Current page: 77 of 85
- Download datasheet (3Mb)
A high level review of the Cypress Pb-free position is available on our website. Specific package information is also available. Package
Material Declaration Datasheets (PMDDs) identify all substances contained within Cypress packages. PMDDs also confirm the
absence of many banned substances. The information in the PMDDs will help Cypress customers plan for recycling or other “end of
life” requirements.
13. Packaging
Table 13-1. Package Characteristics
Table 13-2. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Document Number: 001-55034 Rev. *G
T
T
Tja
Tja
Tja
Tjc
Tjc
Tjc
A
J
Parameter
0.088
0.092
0.025
BSC
25
24
Operating ambient temperature
Operating junction temperature
Package JA (48 SSOP)
Package JA (68 QFN)
Package JA (100 TQFP)
Package JC (48 SSOP)
Package JC (68 QFN)
Package JC (100 TQFP)
Pb-free assemblies (20s to 40s) –
Sn-Ag-Cu solder paste reflow
temperature
Pb-free assemblies (20s to 40s) –
Sn-Pb solder paste reflow
temperature
100-pin TQFP
48-pin SSOP
68-pin QFN
Package
Description
0.620
0.630
Figure 13-1. 48-pin (300 mil) SSOP Package Outline
0.008
0.0135
PRELIMINARY
48
1
0.008
0.016
.020
0.292
0.299
0.095
0.110
0.395
0.420
Conditions
SEATING PLANE
0.004
PSoC
MSL 1
MSL 3
MSL 3
MSL
GAUGE PLANE
®
5: CY8C52 Family Datasheet
.010
DIMENSIONS IN INCHES MIN.
0°-8°
Min
–40
–40
235
205
–
–
–
–
-
-
0.024
0.040
36.87
10.93
29.50
25.48
6.08
7.32
Typ
25
–
–
–
Max
100
245
220
85
–
–
–
-
-
-
MAX.
51-85061-*D
Page 77 of 85
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
0.005
0.010
Units
°C
°C
°C
°C
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