MC9S12DG128VPVE Freescale, MC9S12DG128VPVE Datasheet - Page 103

• Manufacturer Part Number: MC9S12DG128VPVE
• Manufacturer: Freescale

Specifications of MC9S12DG128VPVE

• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 50MHz
• Interface Type: SCI/SPI/I2C/CAN
• Total Internal Ram Size: 8KB
• # I/os (max): 91
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.25V
• Operating Supply Voltage (min): 2.25/2.35/4.5V
• On-chip Adc: 2(8-chx10-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 112
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 128KB
• Lead Free Status / RoHS Status: Compliant

A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
Freescale Semiconductor
Num C
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-3
3. PC Board according to EIA/JEDEC Standard 51-7
10
1
2
3
4
5
6
7
8
9
T Thermal Resistance LQFP112, single sided PCB
T
T Junction to Board LQFP112
T Junction to Case LQFP112
T Junction to Package Top LQFP112
T Thermal Resistance QFP 80, single sided PCB
T
T Junction to Board QFP80
T Junction to Case QFP80
T Junction to Package Top QFP80
Thermal Resistance LQFP112, double sided PCB
with 2 internal planes
Thermal Resistance QFP 80, double sided PCB with
2 internal planes
Table A-5 Thermal Package Characteristics
3
Rating
2
Symbol
Device User Guide — 9S12DT128DGV2/D V02.16
JA
JA
JB
JC
JA
JA
JB
JC
JT
JT
Min
–
–
–
–
–
–
–
–
–
–
1
Typ
–
–
–
–
–
–
–
–
–
–
Max
54
41
31
11
51
41
27
14
2
3
o
o
o
o
o
o
o
o
o
o
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
103