PPC460EX-SUB800N AMCC, PPC460EX-SUB800N Datasheet - Page 23

• Manufacturer Part Number: PPC460EX-SUB800N
• Manufacturer: AMCC

Revision 1.19 – June 17, 2009
Package Diagram
Figure 3. 35mm, 728-Ball TE-PBGA Package
AMCC Proprietary
Preliminary Data Sheet
TYP TYP
30
2.65 max
AM
AP
AH
AK
AD
AB
AF
M
H
D
Y
V
P
K
B
T
F
24
AG
AN
AC
AE
AA
AL
AJ
Bottom View
W
G
Top View
U
R
N
C
E
A
L
J
Side View
01 03 05 07 09 11 13 15 17 19
02 04 06 08 10 12 14 16 18
Compound
Mold
Thermal Balls
35.0
33.0
7.0
20 22 24
21 23 25
Heat Slug
26
27 29 31 33
28 30 32
PCB
Substrate
34
0.4 - 0.6
460EX – PPC460EX Embedded Processor
1.0
728 x 0.60 ± 0.10 Solder Ball
Number
Notes: 1. All dimensions are in mm.
Part
1YWWBZZZZZ
Gold Gate Release
Corresponds to
A01 Ball Location
2. Package is available with lead or
3. Package conforms to JEDEC MS-034.
4. Optional solder ball diameter is
PPC460EX
lead-free (RoHS compliant).
PPC460EX-nprfff(f)T
0.63 +0.07/ − 0.13.
Lot Number (ZZZZZ)
ccccccc
Logo View
MMDDQL
e1
®
23