PPC460EX-SUB800N AMCC, PPC460EX-SUB800N Datasheet - Page 24

• Manufacturer Part Number: PPC460EX-SUB800N
• Manufacturer: AMCC

460EX – PPC460EX Embedded Processor
Assembly Recommendations
Assembly recommendations from JEDEC standard J-STD-020 should be used unless recommended differently in
the following table.
Table 3. Recommended Reflow Soldering Profile
Table 4. JEDEC Moisture Sensitivity Level and Ball Composition
24
Average ramp-up rate
Preheat:
Time Maintained Above:
Peak Temperature
Time within 5 ° C of Actual Peak Temperature
Ramp-down Rate
Time 25 ° C to Peak Temperature
MSL Level
Solder Ball Metallurgy
• Temperature Min
• Temperature Max
• Time (min to max)
• Temperature
• Time
Profile Feature
3
63Sn/37Pb
3 ° C/second max
100 ° C
150 ° C
60–120 seconds
183 ° C
60–150 seconds
225 ° C
20 seconds max
6 ° C/second max
6 minutes max
Sn-Pb Eutectic Assembly
Sn-Pb (PPC460EX-STxfff)
(PPC460EX-STxfff)
3 ° C/second max
150 ° C
200 ° C
60–120 seconds
217 ° C
60–150 seconds
260 ° C
30 seconds max
6 ° C/second max
8 minutes max
Preliminary Data Sheet
3
Sn/4Ag/05Cu
Pb Free Reflow Assembly
Revision 1.19 – June 17, 2009
Pb Free (PPC460EX-SUxfff)
(PPC460EX-SUxfff)
AMCC Proprietary