EP2AGX190FF35C6N Altera, EP2AGX190FF35C6N Datasheet - Page 164

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EP2AGX190FF35C6N

Manufacturer Part Number
EP2AGX190FF35C6N
Description
IC ARRIA II GX 190K 1152FBGA
Manufacturer
Altera
Series
Arria II GXr

Specifications of EP2AGX190FF35C6N

Number Of Logic Elements/cells
181165
Number Of Labs/clbs
7612
Total Ram Bits
9939
Number Of I /o
612
Voltage - Supply
0.87 V ~ 0.93 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1152-FBGA
Family Name
Arria® II GX
Number Of Logic Blocks/elements
190300
# I/os (max)
612
Frequency (max)
400MHz
Operating Supply Voltage (typ)
900mV
Logic Cells
190300
Ram Bits
10380902.4
Operating Supply Voltage (min)
0.87V
Operating Supply Voltage (max)
0.93V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
1152
Package Type
FC-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant

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6–6
Figure 6–2. I/O Banks in Arria II GZ Devices
Notes to
(1) Differential HSTL and SSTL outputs are not true differential outputs. They use two single-ended outputs with the second output programmed as
(2) Column I/O differential HSTL and SSTL inputs use LVDS differential input buffers without R
(3) Column I/O supports LVDS outputs using single-ended buffers and external resistor networks.
(4) Column I/O supports PCI/PCI-X with an on-chip clamp diode. Row I/O supports PCI/PCI-X with an external clamp diode.
(5) Clock inputs on column I/Os are powered by V
(6) Row I/O supports the true LVDS output buffer.
(7) Column and row I/O banks support LVPECL standards for input clock operation.
(8)
Arria II Device Handbook Volume 1: Device Interfaces and Integration
inverted.
single-ended clock inputs. All outputs use the corresponding bank V
Figure 6–2
Figure
is a top view of the silicon die that corresponds to a reverse view for flip chip packages. It is a graphical representation only.
6–2:
Bank 3A
Bank 8A
I/O banks 3A, 3B & 3C support all
single-ended and differential input
and output operation.
Arria II GZ devices contain up to 20 I/O banks as shown in
can support high-performance external memory interfaces with dedicated circuitry.
The I/O pins are organized in pairs to support differential standards. Each I/O pin
pair can support both differential input and output buffers except the clk[1,3,8,10],
PLL_L[1,4]_clk, and PLL_R[1,4]_clk pins, which support differential input
operations only.
I/O banks 8A, 8B & 8C support all
single-ended and differential input
and output operation.
Bank 3B
Bank 8B
CCCLKIN
Row I/O banks support LVTTL, LVCMOS, 2.5-V, 1.8-
V, 1.5-V, 1.2-V, SSTL-2 Class I & II, SSTL-18 Class I
& II, SSTL-15 Class I, HSTL-18 Class I & II, HSTL-15
Class I, HSTL-12 Class I, LVDS, RSDS, mini-LVDS,
differential SSTL-2 Class I & II, differential SSTL-18
Class I & II, differential SSTL-15 Class I, differential
HSTL-18 Class I & II, differential HSTL-15 Class I and
differential HSTL-12 Class I standards for input and
output operation.
SSTL-15 class II, HSTL-15 Class II, HSTL-12 Class II,
differential SSTL-15 Class II, differential HSTL-15
Class II, differential HSTL-12 Class II standards are
only supported for input operations
(Note
when configured as differential clock inputs. They are powered by V
1), (2), (3), (4), (5), (6), (7),
Bank 8C
Bank 3C
CCIO
.
Bank 7C
Bank 4C
D
OCT support.
I/O banks 4A, 4B & 4C support all
single-ended and differential input
and output operation.
I/O banks 7A, 7B & 7C support all
single-ended and differential input
and output operation.
(8)
Chapter 6: I/O Features in Arria II Devices
Bank 7B
Bank 4B
Figure
December 2010 Altera Corporation
6–2. Each I/O bank
CCIO
Bank 7A
Bank 4A
when configured as
I/O Banks

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