MPC8343VRAGDB Freescale Semiconductor, MPC8343VRAGDB Datasheet - Page 24

IC MPU POWERQUICC II 620-PBGA

MPC8343VRAGDB

Manufacturer Part Number
MPC8343VRAGDB
Description
IC MPU POWERQUICC II 620-PBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheet

Specifications of MPC8343VRAGDB

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
400MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
620-PBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8349E-MITXE
Maximum Clock Frequency
400 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
400MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
BGA
No. Of Pins
620
Rohs Compliant
Yes
Family Name
MPC83xx
Device Core
PowerQUICC II Pro
Device Core Size
32b
Frequency (max)
400MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.2V
Operating Supply Voltage (max)
1.26V
Operating Supply Voltage (min)
1.14V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
620
Package Type
BGA
For Use With
CWH-PPC-8343N-VX - KIT EVAL SYSTEM QUICCSTART 8248CWH-PPC-8343N-VE - EVALUATION SYSTEM QUICC MPC8343E
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Ethernet: Three-Speed Ethernet, MII Management
8.2.1.2
Table 26
Figure 9
Figure 10
24
At recommended operating conditions with LV
RX_CLK clock period 10 Mbps
RX_CLK clock period 100 Mbps
RX_CLK duty cycle
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
RX_CLK clock rise (20%–80%)
RX_CLK clock fall time (80%–20%)
Note:
1. The symbols for timing specifications follow the pattern of t
and t
(MR) with respect to the time data input signals (D) reach the valid state (V) relative to the t
the high (H) state or setup time. Also, t
(D) went invalid (X) relative to the t
reference symbol is based on three letters representing the clock of a particular function. For example, the subscript of t
represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter:
R (rise) or F (fall).
(first two letters of functional block)(reference)(state)(signal)(state)
provides the AC test load for TSEC.
provides the MII receive AC timing specifications.
shows the MII receive AC timing diagram.
MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10
MII Receive AC Timing Specifications
RXD[3:0]
Parameter/Condition
RX_CLK
RX_DV
RX_ER
Output
Table 26. MII Receive AC Timing Specifications
MRX
Figure 10. MII Receive AC Timing Diagram
t
t
MRXH
MRDVKH
DD
MRDXKL
clock reference (K) going to the low (L) state or hold time. In general, the clock
/OV
Figure 9. TSEC AC Test Load
t
DD
MRX
symbolizes MII receive timing (GR) with respect to the time data input signals
of 3.3 V ± 10%.
Z
0
= 50 Ω
Valid Data
for outputs. For example, t
(first two letters of functional block)(signal)(state)(reference)(state)
t
MRXH
Symbol
t
t
t
MRXF
MRDVKH
MRDXKH
t
t
t
t
MRXR
MRXF
MRX
MRX
/t
MRX
1
R
t
MRDXKH
L
t
MRXR
= 50 Ω
10.0
10.0
Min
1.0
1.0
35
MRDVKH
OV
MRX
DD
Typ
400
40
symbolizes MII receive timing
/2
clock reference (K) going to
Freescale Semiconductor
Max
4.0
4.0
65
for inputs
Unit
ns
ns
ns
ns
ns
ns
%
MRX

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