MPC8343VRAGDB Freescale Semiconductor, MPC8343VRAGDB Datasheet - Page 67

• Manufacturer Part Number: MPC8343VRAGDB
• Description: IC MPU POWERQUICC II 620-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8343VRAGDB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 400MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 620-PBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 400 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 400MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 620
• Rohs Compliant: Yes
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 400MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.2V
• Operating Supply Voltage (max): 1.26V
• Operating Supply Voltage (min): 1.14V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 620
• Package Type: BGA
• For Use With: CWH-PPC-8343N-VX - KIT EVAL SYSTEM QUICCSTART 8248CWH-PPC-8343N-VE - EVALUATION SYSTEM QUICC MPC8343E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

20 Thermal
This section describes the thermal specifications of the MPC8343EA.
20.1
.Table 59
20.2
For the following sections, P
See
20.2.1
An estimation of the chip junction temperature, T
where:
Freescale Semiconductor
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single-layer board (1s)
Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Junction-to-package natural convection on top
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1).
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 5
T
T
R
P
A
J
θ
D
Thermal Characteristics
provides the package thermal characteristics for the 620 29 × 29 mm PBGA of the MPC8343EA.
Thermal Management Information
JA
= junction temperature (°C)
= ambient temperature for the package (°C)
= power dissipation in the package (W)
MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
for I/O power dissipation values.
= junction-to-ambient thermal resistance (°C/W)
T
J
Table 59. Package Thermal Characteristics for PBGA
= T
Parameter
D
A
= (V
+ (R
DD
θ
JA
× I
× P
DD
D
) + P
)
I/O
J
, can be obtained from the equation:
where P
I/O
is the power dissipation of the I/O drivers.
Symbol
R
R
R
R
R
R
ψ
θJMA
θJMA
θJMA
θJA
θJB
θJC
JT
Value
21
15
17
12
6
5
5
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
Thermal
1, 2
1, 3
1, 3
1, 3
4
5
6
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