MPC8343VRAGDB Freescale Semiconductor, MPC8343VRAGDB Datasheet - Page 69

• Manufacturer Part Number: MPC8343VRAGDB
• Description: IC MPU POWERQUICC II 620-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8343VRAGDB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 400MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 620-PBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 400 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 400MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 620
• Rohs Compliant: Yes
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 400MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.2V
• Operating Supply Voltage (max): 1.26V
• Operating Supply Voltage (min): 1.14V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 620
• Package Type: BGA
• For Use With: CWH-PPC-8343N-VX - KIT EVAL SYSTEM QUICCSTART 8248CWH-PPC-8343N-VE - EVALUATION SYSTEM QUICC MPC8343E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
20.2.4
Some application environments require a heat sink to provide the necessary thermal management of the
device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
where:
R
change the case-to-ambient thermal resistance, R
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because there is not a standard
application environment, a standard heat sink is not required.
Table 60
Freescale Semiconductor
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
MEI, 75 × 85 × 12 no adjacent board, extrusion
θ
f
JC
is device-related and cannot be influenced by the user. The user controls the thermal environment to
R
R
R
θ
θ
θ
shows heat sink thermal resistance for PBGA of the MPC8343EA.
JA
JC
CA
MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10
Heat Sink Assuming Thermal Grease
Heat Sinks and Junction-to-Case Thermal Resistance
= junction-to-ambient thermal resistance (°C/W)
= junction-to-case thermal resistance (°C/W)
= case-to-ambient thermal resistance (°C/W)
Table 60. Heat Sink and Thermal Resistance of MPC8343EA (PBGA)
R
θ
JA
= R
θ
JC
+ R
θ
CA
θ
CA
. For instance, the user can change the size of the heat
Natural convection
Natural convection
Natural convection
Natural convection
Air Flow
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
Thermal Resistance
29 × 29 mm PBGA
11.3
13.5
10.1
9.6
8.8
8.1
7.5
9.1
7.1
6.5
Thermal
69