XPC8240RZU250E Freescale Semiconductor, XPC8240RZU250E Datasheet - Page 11

• Manufacturer Part Number: XPC8240RZU250E
• Description: MCU HOST PROCESSOR 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8240RZU250E

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 250MHz
• Embedded Interface Type: I2C
• Digital Ic Case Style: TBGA
• No. Of Pins: 352
• Supply Voltage Range: 2.5V To 2.75V
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core Size: 32b
• Frequency (max): 250MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.625/2.6255V
• Operating Supply Voltage (max): 2.75625/2.756775V
• Operating Supply Voltage (min): 2.49375/2.494225V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 352
• Package Type: TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

1.4.1.5
Table 5 provides power consumption data for the MPC8240.
1.4.2
This section provides the AC electrical characteristics for the MPC8240. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Table 6 and tested for conformance to the AC
specifications for that frequency. The processor core frequency is determined by the bus (PCI_SYNC_IN)
MPC8240 Integrated Processor Hardware Specifications
Typical
Maximum—FP
Maximum—INT
Doze
Nap
Sleep
Typical—OV
Typical—GV
Notes:
1. The values include V
2. Maximum—FP power is measured at V
3. Maximum—INT power is measured at V
4. Power saving mode maximums are measured at V
5. Typical power is measured at V
6. Power saving mode data measured with only two PCI_CLKs and two SDRAM_CLKs enabled.
7. The typical minimum I/O power values were results of the MPC8240 performing cache resident integer operations
8. The typical maximum OV
9. The typical maximum GV
10.Power consumption on the PLL supply pins (AV
Supply Sizing,” for information on OV
entirely cache-resident, looping, floating-point multiplication instruction.
cache-resident, looping, integer instructions.
and a value where there is a continuous flush of cache lines with alternating ones and zeros on 64-bit boundaries
to local memory are averaged.
at the slowest frequency combination of 33:66:166 (PCI:Mem:CPU) MHz.
66:100:250 (PCI:Mem:CPU) MHz and performing continuous flushes of cache lines with alternating ones and
zeros to PCI memory.
66:100:250 (PCI:Mem:CPU) MHz and performing continuous flushes of cache lines with alternating ones and
zeros on 64-bit boundaries to local memory.
This parameter is guaranteed by design and is not tested.
Mode
Mode
DD
DD
AC Electrical Characteristics
Power Characteristics
DD
, AV
33/66/166
DD
DD
667
477
DD
Freescale Semiconductor, Inc.
2.5
2.9
2.6
1.8
value resulted from the MPC8240 operating at the fastest frequency combination of
value resulted from the MPC8240 operating at the fastest frequency combination of
, AV
For More Information On This Product,
Table 5. Preliminary Power Consumption
DD
DD
= AV
Min
200
300
2, and LAV
PCI Bus Clock/Memory Bus Clock
DD
DD
DD
DD
Go to: www.freescale.com
CPU Clock Frequency (MHz)
and GV
33/66/200
= 2.5 V with dynamic power management enabled while running entirely
= 2.5 V with dynamic power management enabled while running an
= 2.5 V, OV
I/O Power Supplies
667
477
2.8
3.3
2.9
1.9
DD
DD
DD
DD
but do not include I/O supply power; see Section 1.7.2, “Power
and AV
supply power. One DIMM is used for memory loading.
= 2.5 V while the device is in doze, nap, or sleep mode.
DD
= 3.3 V where a nominal FP value, a nominal INT value,
DD
33/100/200
2) and the DLL supply pin (LAV
858
477
3.0
3.5
3.2
2.1
Electrical and Thermal Characteristics
Max
600
900
66/100/200
858
762
3.0
3.5
3.3
2.1
DD
) less than15 mW.
Unit
Unit
mW
mW
mW
mW
W
W
W
W
Notes
1, 4, 6
1, 4, 6
1, 4, 6
Notes
1, 5
1, 2
1, 3
7, 8
7, 9
11