XPC8240RZU250E Freescale Semiconductor, XPC8240RZU250E Datasheet - Page 42

• Manufacturer Part Number: XPC8240RZU250E
• Description: MCU HOST PROCESSOR 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8240RZU250E

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 250MHz
• Embedded Interface Type: I2C
• Digital Ic Case Style: TBGA
• No. Of Pins: 352
• Supply Voltage Range: 2.5V To 2.75V
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core Size: 32b
• Frequency (max): 250MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.625/2.6255V
• Operating Supply Voltage (max): 2.75625/2.756775V
• Operating Supply Voltage (min): 2.49375/2.494225V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 352
• Package Type: TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

System Design Information
System Design Information
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.7.8.1
The intrinsic conduction thermal resistance paths for the TBGA, cavity-down, packaging technology shown
in Figure 26 are as follows:
Figure 28 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
For this cavity-down, wire-bond TBGA package, heat generated on the active side of the chip is conducted
through the silicon, die attach, and package spreader, through the heat sink attach material (or thermal
interface material), and finally to the heat sink, where it is removed by forced-air convection.
1.7.8.2
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize thermal
contact resistance. For those applications where the heat sink is attached by a spring clip mechanism,
Figure 29 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
42
•
•
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 28. TBGA Package with Heat Sink Mounted to a Printed-Circuit Board
(Note the internal versus external package resistance.)
Internal Package Conduction Resistance
Adhesives and Thermal Interface Materials
External Resistance
External Resistance
Internal Resistance
MPC8240 Integrated Processor Hardware Specifications
Freescale Semiconductor, Inc.
Printed-Circuit Board
For More Information On This Product,
Heat Sink
Go to: www.freescale.com
Radiation
Radiation
Convection
Convection
Thermal Interface Material
800-522-6752
603-635-5102
Die/Package
Die Junction
Package/Leads