XPC8240RZU250E Freescale Semiconductor, XPC8240RZU250E Datasheet - Page 41

• Manufacturer Part Number: XPC8240RZU250E
• Description: MCU HOST PROCESSOR 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8240RZU250E

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 250MHz
• Embedded Interface Type: I2C
• Digital Ic Case Style: TBGA
• No. Of Pins: 352
• Supply Voltage Range: 2.5V To 2.75V
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core Size: 32b
• Frequency (max): 250MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.625/2.6255V
• Operating Supply Voltage (max): 2.75625/2.756775V
• Operating Supply Voltage (min): 2.49375/2.494225V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 352
• Package Type: TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

The board designer can choose between several types of heat sinks to place on the MPC8240. Several
commercially-available heat sinks for the MPC8240 are provided by the following vendors:
MPC8240 Integrated Processor Hardware Specifications
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
The Bergquist Company
18930 West 78
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
18
16
14
12
10
8
6
4
2
0
th
St.
Freescale Semiconductor, Inc.
Figure 27. Die Junction-to-Ambient Resistance
0.5
For More Information On This Product,
Go to: www.freescale.com
Airflow Velocity (m/s)
1
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components
1.5
603-224-9988
408-749-7601
800-347-4572
818-842-7277
2
System Design Information
2.5
41