MPC8544VTALF Freescale Semiconductor, MPC8544VTALF Datasheet - Page 103
![MPU POWERQUICC III 783-PBGA](/photos/37/62/376266/mpc8544e_image_sml.jpg)
MPC8544VTALF
Manufacturer Part Number
MPC8544VTALF
Description
MPU POWERQUICC III 783-PBGA
Manufacturer
Freescale Semiconductor
Datasheets
1.MPC8544VTALF.pdf
(117 pages)
2.MPC8544VTALF.pdf
(2 pages)
3.MPC8544VTALF.pdf
(1340 pages)
Specifications of MPC8544VTALF
Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
667MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
Processor Series
MPC85xx
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
667 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
1.8 V, 3.3 V
Interface Type
I2C, HSSI, DUART
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8544VTALF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC8544VTALFA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
20.3.3
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
where
During operation the die-junction temperatures (T
Table
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
may range from 30° to 40°C. The air temperature rise within a cabinet (T
10°C. The thermal resistance of the thermal interface material (θ
of 30°C, a T
expression for T
The heat sink-to-ambient thermal resistance (θ
#2328B is shown in
Assuming an air velocity of 1 m/s, we have an effective θ
resulting in a die-junction temperature of approximately 66, which is well within the maximum operating
temperature of the component.
Freescale Semiconductor
2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Thermagon Inc. 888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
T
T
T
θ
θ
θ
P
JC
INT
SA
D
J
I
R
is the die-junction temperature
is the inlet cabinet ambient temperature
is the power dissipated by the device
is the air temperature rise within the computer cabinet
is the junction-to-case thermal resistance
is the heat sink base-to-ambient thermal resistance
Heat Sink Selection Examples
R
is the adhesive or interface material thermal resistance
T
of 5°C, a FC-PBGA package θ
Die-junction temperature: T
T
J
J
J
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
= T
= 30° + 5°C + (0.1°C/W + 1.0°C/W + 5°C/W) × 5
is obtained:
Figure
I
+ T
R
+ (θ
64.
JC
+ θ
INT
+ θ
J
= 30°C + 5°C + (0.1°C/W + 1.0°C/W + θ
SA
JC
SA
) × P
= 0.1, and a power consumption (P
) versus airflow velocity for a Thermalloy heat sink
J
) should be maintained within the range specified in
D
SA+
of about 5°C/W, thus
INT
) may be about 1°C/W. Assuming a T
R
) may be in the range of 5° to
D
) of 5, the following
SA
) × P
D
Thermal
103
I
)
I