MPC8544VTALF Freescale Semiconductor, MPC8544VTALF Datasheet - Page 71
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MPC8544VTALF
Manufacturer Part Number
MPC8544VTALF
Description
MPU POWERQUICC III 783-PBGA
Manufacturer
Freescale Semiconductor
Datasheets
1.MPC8544VTALF.pdf
(117 pages)
2.MPC8544VTALF.pdf
(2 pages)
3.MPC8544VTALF.pdf
(1340 pages)
Specifications of MPC8544VTALF
Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
667MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
Processor Series
MPC85xx
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
667 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
1.8 V, 3.3 V
Interface Type
I2C, HSSI, DUART
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8544VTALF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC8544VTALFA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
16.2.4
The clock driver selected should provide a high quality reference clock with low phase noise and
cycle-to-cycle jitter. Phase noise less than 100 kHz can be tracked by the PLL and data recovery loops and
is less of a problem. Phase noise above 15 MHz is filtered by the PLL. The most problematic phase noise
occurs in the 1–15 MHz range. The source impedance of the clock driver should be 50 Ω to match the
transmission line and reduce reflections which are a source of noise to the system.
Table 57
Freescale Semiconductor
Rising Edge Rate
Falling Edge Rate
Differential Input High Voltage
Differential Input Low Voltage
Rising edge rate (SDn_REF_CLK) to falling edge rate
(SDn_REF_CLK) matching
Notes:
1. Measurement taken from single ended waveform.
2. Measurement taken from differential waveform.
3. Measured from –200 mV to +200 mV on the differential waveform (derived from SDn_REF_CLK minus SDn_REF_CLK). The
4. Matching applies to rising edge rate for SDn_REF_CLK and falling edge rate for SDn_REF_CLK. It is measured using a
signal must be monotonic through the measurement region for rise and fall time. The 400 mV measurement window is
centered on the differential zero crossing. See
200 mV window centered on the median cross point where SDn_REF_CLK rising meets SDn_REF_CLK falling. The median
cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. The rise edge
rate of SDn_REF_CLK should be compared to the fall edge rate of SDn_REF_CLK, the maximum allowed difference should
not exceed 20% of the slowest edge rate. See
SDn_REF_CLK
SDn_REF_CLK
V
V
IH
IL
= +200 mV
= –200 mV
describes some AC parameters common to SGMII, and PCI Express protocols.
AC Requirements for SerDes Reference Clocks
minus
0.0 V
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Parameter
Figure 53. Differential Measurement Points for Rise and Fall Time
Table 57. SerDes Reference Clock Common AC Parameters
Rise Edge Rage
Figure
Figure
54.
53.
Rise-Fall Matching
Rise Edge Rate
Fall Edge Rate
Symbol
V
V
IH
IL
Fall Edge Rate
+200
Min
1.0
1.0
—
—
High-Speed Serial Interfaces (HSSI)
–200
Max
4.0
4.0
20
—
Unit
V/ns
V/ns
mV
mV
%
Notes
2, 3
2, 3
1, 4
2
2
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