MPC8544VTALF Freescale Semiconductor, MPC8544VTALF Datasheet - Page 13
![MPU POWERQUICC III 783-PBGA](/photos/37/62/376266/mpc8544e_image_sml.jpg)
MPC8544VTALF
Manufacturer Part Number
MPC8544VTALF
Description
MPU POWERQUICC III 783-PBGA
Manufacturer
Freescale Semiconductor
Datasheets
1.MPC8544VTALF.pdf
(117 pages)
2.MPC8544VTALF.pdf
(2 pages)
3.MPC8544VTALF.pdf
(1340 pages)
Specifications of MPC8544VTALF
Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
667MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
Processor Series
MPC85xx
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
667 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
1.8 V, 3.3 V
Interface Type
I2C, HSSI, DUART
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8544VTALF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC8544VTALFA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
3
The estimated typical core power dissipation for the core complex bus (CCB) versus the core frequency
for this family of PowerQUICC III devices is shown in
4
This section contains the following subsections:
Freescale Semiconductor
Typical
Thermal
Maximum
Typical
Thermal
Maximum
Typical
Thermal
Maximum
Typical
Thermal
Maximum
Notes:
1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and
2. Typical power is an average value measured at the nominal recommended core voltage (V
3. Thermal power is the average power measured at nominal core voltage (V
4. Maximum power is the maximum power measured at nominal core voltage (V
Power Mode
configurations. The values do not include power dissipation for I/O supplies.
(see
(see
temperature (see
instructions which keep the execution unit maximally busy.
•
•
•
•
•
Table
Table
Power Characteristics
Input Clocks
Section 4.1, “System Clock Timing”
Section 4.2, “Real-Time Clock Timing”
Section 4.3, “eTSEC Gigabit Reference Clock Timing”
Section 4.4, “Platform to FIFO Restrictions”
Section 4.5, “Other Input Clocks”
2) while running the Dhrystone 2.1 benchmark.
2) while running the Dhrystone 2.1 benchmark.
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Table
Core Frequency
2) while running a smoke test which includes an entirely L1-cache-resident, contrived sequence of
(MHz)
1000
1067
667
800
Table 4. MPC8544ECore Power Dissipation
Platform Frequency
(MHz)
333
400
400
533
Table
V
(V)
1.0
1.0
1.0
1.0
DD
4.
DD
) and maximum operating junction temperature
DD
Temperature (°C)
) and maximum operating junction
Junction
105
105
105
105
65
65
65
65
DD
) and 65°C junction temperature
Power
Power Characteristics
7.15
7.35
(W)
2.6
4.5
2.9
4.8
3.6
5.3
7.5
3.9
6.0
7.7
Notes
1, 2
1, 3
1, 4
1, 2
1, 3
1, 4
1, 2
1, 3
1, 4
1, 2
1, 3
1, 4
13