Z0840004PSC Zilog, Z0840004PSC Datasheet - Page 36

• Manufacturer Part Number: Z0840004PSC
• Description: IC 4MHZ Z80 NMOS CPU 40-DIP
• Manufacturer: Zilog

Specifications of Z0840004PSC

• Processor Type: Z80
• Features: NMOS
• Speed: 4MHz
• Voltage: 5V
• Mounting Type: Through Hole
• Package / Case: 40-DIP (0.620", 15.75mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ZiLOG
2002 Quality and Reliability Report
ZiLOG’S RELIABILITY SUMMARY
ZiLOG’s reliability program is unique, in that the reliability testing takes place on standard
production material at the point of assembly. Reliability testing has been integrated into the
manufacturing process. This flow creates a “Quick Reaction” reliability monitor, and allows
ZiLOG to ensure the integrity of material prior to shipment, gather trend analysis data for internal
corrective actions, and maintain a meaningful database for customer review.
The tests currently employed under ZiLOG’s quick reaction reliability monitor, include early life
(burn-in), steam pressure pot, and temperature cycle. Testing conditions are included with the
attached test results.
In addition to early life testing, a long-term life test is performed on selected lots to gather FIT data.
Test conditions and FIT calculations are included with the attached data. Following are brief
descriptions of various reliability tests included in this program:
EARLY LIFE
Early Life testing, also called burn-in, is typically performed at 125°C for 168 hours. A dynamic or
static bias is employed, depending on the device that is being tested. Early Life test results expose
process or assembly defects. These results are a valuable measure of a given fabrication or
assembly process.
LONG TERM LIFE
Long Term Life testing is generally performed at 150°C for 184 hours. Either dynamic or static
bias is used to stress the device appropriately. These test results are used to estimate field operation
lifetime for a device. This data can be applied to all products manufactured using the same
fabrication process.
PRESSURE POT
Pressure pot testing is performed at 121°C, 15 PSIG, and 100% relative humidity. This test
evaluates the ability of a plastic device to withstand the long-term effects of a humid environment.
TEMPERATURE CYCLE
Temperature Cycle testing is performed at a –65°C to 150°C temperature. This test uses an air-to-
air environment. The 215°C cold to hot temperature difference determines if proper thermal
expansion matching exists between all materials used in device manufacture. The temperature
cycle simulates the thermal stresses a device undergoes during power-up and power-down events.
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