Z0840004PSC Zilog, Z0840004PSC Datasheet - Page 90

IC 4MHZ Z80 NMOS CPU 40-DIP

Z0840004PSC

Manufacturer Part Number
Z0840004PSC
Description
IC 4MHZ Z80 NMOS CPU 40-DIP
Manufacturer
Zilog
Datasheet

Specifications of Z0840004PSC

Processor Type
Z80
Features
NMOS
Speed
4MHz
Voltage
5V
Mounting Type
Through Hole
Package / Case
40-DIP (0.620", 15.75mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
Z0840004PSC
Manufacturer:
ZILOG
Quantity:
2 000
Part Number:
Z0840004PSC
Quantity:
38
Part Number:
Z0840004PSC
Manufacturer:
MOT
Quantity:
22
Part Number:
Z0840004PSC
Manufacturer:
ZILIOG
Quantity:
1 000
Part Number:
Z0840004PSC
Manufacturer:
ZILOG
Quantity:
20 000
Company:
Part Number:
Z0840004PSC
Quantity:
903
Part Number:
Z0840004PSC (Z80CPU)
Manufacturer:
ZILOG
Quantity:
20 000
Part Number:
Z0840004PSC(Z80CPU)
Manufacturer:
ZILOG
Quantity:
20 000
Part Number:
Z0840004PSC/Z80-CPU
Manufacturer:
ST
0
ZiLOG
ZAC03-0004
TERM
Ǻ:
Accelerated Life Test:
Acceleration Factor:
Activation Energy (Ae):
AES:
Align:
APCVD:
ASSP:
AQL:
Bonding:
Bond Pads:
Burn-In:
DEFINITION
Symbol for Angstrom, which equals 10
of a meter).
A life test, in which the applied stress level exceeds that needed in
actual use in order to shorten the time required to observe failure. A
good accelerated test should not alter the basic modes and/or
mechanisms of failure.
The ratio of the times needed to obtain the same failure rates under
two different sets of stress conditions involving the same failure
modes or mechanisms.
The energy level needed to activate a specific failure mechanism.
Auger Electron Spectroscopy typically used for interlayer
dielectrics and passivation films.
The operation of exposing a resist covered wafer in a projection
printer.
Atmospheric Pressure Chemical Vapor Deposition. One method for
deposition of glass used for interlayer or passivation dielectric.
Application Specific Standard Product.
Acceptable Quality Level. Generally, 95 percent confidence that
material of the stated AQL will pass sample inspection.
The act of connecting package leads to specified locations on the
chip via fine wire.
Exposed aluminum pads on a chip to which wires from the package
lead frame are bonded during assembly.
The operation of a device prior to its application, at elevated
temperature and/or voltage for a specific period of time. The
purpose is to stabilize the device characteristics, identify early
failures, and eliminate devices subject to infant mortality or
excessive parametric drift.
2002 Quality and Reliability Report
-10
CHAPTER 11
meters (one ten-billionth
Glossary
11- 1

Related parts for Z0840004PSC