Z0840004PSC Zilog, Z0840004PSC Datasheet - Page 9

• Manufacturer Part Number: Z0840004PSC
• Description: IC 4MHZ Z80 NMOS CPU 40-DIP
• Manufacturer: Zilog

Specifications of Z0840004PSC

• Processor Type: Z80
• Features: NMOS
• Speed: 4MHz
• Voltage: 5V
• Mounting Type: Through Hole
• Package / Case: 40-DIP (0.620", 15.75mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ZiLOG
2002Quality and Reliability Report
Order Acknowledgment Policy
One definition of vendor quality performance is that the vendor “does what he promises or
acknowledges.” Acceptable reliability and quality is achieved only if ZiLOG and the customer
are in agreement on product and delivery specifications.
Test Guardbanding
No physical attribute is absolute. Customers’ test methods may differ from ZiLOG’s due to
variations in test equipment, temperature or specification interpretation. To ensure that every
ZiLOG product performs to full customer expectations, ZiLOG uses a “waterfall” methodology
in its testing. The first electrical tests made on the circuit for both AC and DC parameters, at the
wafer probe operation, are guardbanded to the final test specifications. The final test
specifications for both AC and DC parameters, in turn, are guardbanded to the quality control
outgoing sample. The quality control outgoing sample is guardbanded to data sheet
specifications. This technique of “waterfall” guardbanding eliminates circuits which may be
marginal to the customer’s expectations long before they get to the shipping container.
Probe at Temperature
Semiconductor devices tend to exhibit their most limited performance at the highest operating
temperature. Therefore, it is ZiLOG’s policy that all chips are tested at high temperature the
very first time they are electrically screened at the wafer probe station. The circuits are tested
again at their upper operating temperature limit in the 100% final test operation.
Process Characterization
Before release to production, every process is thoroughly characterized by an exhaustive series
of pilot production runs and tests which identify the statistical, electrical, and mechanical limits
of that particular process. This documentation is maintained as the historical record or
“footprint” for that particular regime.
Process recharacterization is done any time there is a major process or manufacturing site
change, and the resulting documentation is then added to the characterization history. Once the
process is fully characterized, test site evaluation and process template data is gathered
frequently to make sure that the process remains in specification.
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