DSPIC30F2020-30I/SP Microchip Technology Inc., DSPIC30F2020-30I/SP Datasheet - Page 270
DSPIC30F2020-30I/SP
Manufacturer Part Number
DSPIC30F2020-30I/SP
Description
DSP, 16-Bit, 12KB Flash, 512 RAM, 21 I/O, SDIP-28
Manufacturer
Microchip Technology Inc.
Type
DSPr
Datasheet
1.DSPIC30F2023-30IPT.pdf
(286 pages)
Specifications of DSPIC30F2020-30I/SP
A/d Inputs
8-Channels, 10-Bit
Comparators
4
Cpu Speed
30 MIPS
Eeprom Memory
0 Bytes
Input Output
21
Interface
I2C/SPI/UART
Ios
21
Memory Type
Flash
Number Of Bits
16
Package Type
28-pin SPDIP
Programmable Memory
12K Bytes
Ram Size
512 Bytes
Timers
3-16-bit, 1-32-bit
Voltage, Range
3-5.5
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
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dsPIC30F1010/202X
28-Lead Plastic Quad Flat, No Lead Package (MM) - 6x6x0.9 mm Body (QFN-S)
With 0.40 mm Contact Length
DS70178C-page 268
Note:
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
N
Dimension Limits
A1
2
1
Preliminary
EXPOSED
E
A
Microchip Technology Drawing No. C04–124, Sept. 8, 2006
NOTE 1
Units
PAD
A1
A3
E2
D2
E2
N
A
E
D
K
e
b
L
2
1
MIN
0.80
0.00
3.65
3.65
0.23
0.30
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.38
0.40
28
—
D2
MAX
1.00
0.05
4.70
4.70
0.43
0.50
© 2006 Microchip Technology Inc.
—
L
b
e
K
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