DSPIC30F2020-30I/SP Microchip Technology Inc., DSPIC30F2020-30I/SP Datasheet - Page 272
DSPIC30F2020-30I/SP
Manufacturer Part Number
DSPIC30F2020-30I/SP
Description
DSP, 16-Bit, 12KB Flash, 512 RAM, 21 I/O, SDIP-28
Manufacturer
Microchip Technology Inc.
Type
DSPr
Datasheet
1.DSPIC30F2023-30IPT.pdf
(286 pages)
Specifications of DSPIC30F2020-30I/SP
A/d Inputs
8-Channels, 10-Bit
Comparators
4
Cpu Speed
30 MIPS
Eeprom Memory
0 Bytes
Input Output
21
Interface
I2C/SPI/UART
Ios
21
Memory Type
Flash
Number Of Bits
16
Package Type
28-pin SPDIP
Programmable Memory
12K Bytes
Ram Size
512 Bytes
Timers
3-16-bit, 1-32-bit
Voltage, Range
3-5.5
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
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dsPIC30F1010/202X
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
DS70178C-page 270
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
§
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
2
1
D
L
MIN
Preliminary
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
28
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
© 2006 Microchip Technology Inc.
NOM
28
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8
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