DSPIC30F2020-30I/SP Microchip Technology Inc., DSPIC30F2020-30I/SP Datasheet - Page 271
DSPIC30F2020-30I/SP
Manufacturer Part Number
DSPIC30F2020-30I/SP
Description
DSP, 16-Bit, 12KB Flash, 512 RAM, 21 I/O, SDIP-28
Manufacturer
Microchip Technology Inc.
Type
DSPr
Datasheet
1.DSPIC30F2023-30IPT.pdf
(286 pages)
Specifications of DSPIC30F2020-30I/SP
A/d Inputs
8-Channels, 10-Bit
Comparators
4
Cpu Speed
30 MIPS
Eeprom Memory
0 Bytes
Input Output
21
Interface
I2C/SPI/UART
Ios
21
Memory Type
Flash
Number Of Bits
16
Package Type
28-pin SPDIP
Programmable Memory
12K Bytes
Ram Size
512 Bytes
Timers
3-16-bit, 1-32-bit
Voltage, Range
3-5.5
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
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28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
MIN
1.345
Preliminary
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
28
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
10
10
dsPIC30F1010/202X
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
p
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
A2
L
DS70178C-page 269
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15
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