MC68EC040RC25 Freescale Semiconductor, MC68EC040RC25 Datasheet - Page 349

• Manufacturer Part Number: MC68EC040RC25
• Manufacturer: Freescale Semiconductor

Specifications of MC68EC040RC25

• Family Name: M68000
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 25MHz
• Instruction Set Architecture: RISC
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Through Hole
• Pin Count: 179
• Package Type: PGA
• Lead Free Status / Rohs Status: Supplier Unconfirmed

In the specification provided by Thermalloy, Inc., a chart illustrates the heat-sink
temperature rise above ambient versus heat dissipated. This chart applies if no airflow is
used with the heat-sink. Table 11-5 lists the calculations based on this chart.
MOTOROLA
MHz
25
25
25
33
33
33
20
25
33
Table 11-5. Thermal Parameters with Heat Sink and No Airflow
Airflow Velocity
Thermal Mgmt.
Technique
0
0
0
0
0
0
0
0
0
Figure 11-11. Heat Sink with Attachment
Freescale Semiconductor, Inc.
For More Information On This Product,
10.0 W
6.3 W
6.6 W
8.6 W
7.7 W
8.0 W
4.0 W
5.0 W
6.3 W
P
Go to: www.freescale.com
MC68LC040 and MC68EC040
M68040 USER’S MANUAL
D
Defined Parameters
110 C
110 C
110 C
110 C
110 C
110 C
110 C
110 C
110 C
MC68040
T
J
3 C/W
3 C/W
3 C/W
3 C/W
3 C/W
3 C/W
3 C/W
3 C/W
3 C/W
JC
Heat-Sink
64.4 C
66.8 C
82.8 C
75.6 C
78.0 C
94.0 C
45.0 C
54.0 C
64.4 C
T
Spec.
C
–T
A
SPRING
HEAT SINK
PIN GRID
ARRAY
FRAME
91.1 C
90.2 C
84.2 C
86.9 C
86.0 C
80.0 C
98.0 C
95.0 C
91.1 C
T
Calculated
C
–14.0 C
26.7 C
23.4 C
11.3 C
53.0 C
41.0 C
26.7 C
1.4 C
8.0 C
T
A
11-21