TDA8932BTW/N2,118 NXP Semiconductors, TDA8932BTW/N2,118 Datasheet - Page 28

• Manufacturer Part Number: TDA8932BTW/N2,118
• Description: IC AMP AUDIO CLASS D 32HTSSOP
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDA8932BTW/N2,118

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Max Output Power X Channels @ Load: 55W x 1 @ 8 Ohm; 26.5W x 2 @ 4 Ohm
• Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Product: Class-D
• Output Power: 55 W
• Available Set Gain: 36 dB
• Common Mode Rejection Ratio (min): 75 dB
• Thd Plus Noise: 0.007 %
• Operating Supply Voltage: 22 V
• Supply Current: 0.145 mA
• Maximum Power Dissipation: 5000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Dual Supply Voltage: +/- 11 V
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single or Dual
• Supply Voltage (max): 36 V
• Supply Voltage (min): 10 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935283479118

NXP Semiconductors
UJA1079_2
Product data sheet
Table 9.
[1]
[2]
Symbol
R
Fig 12. HTSSOP32 thermal resistance junction to ambient as a function of PCB copper
th(j-a)
According to JEDEC JESD51-2 and JESD51-3 at natural convection on 1s board.
According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with
two inner copper layers (thickness: 35 μm) and thermal via array under the exposed pad connected to the
first inner copper layer.
R
(K/W)
th(j-a)
90
70
50
30
area
Parameter
thermal resistance from junction to
ambient
Thermal characteristics
0
with heatsink top layer
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
2
without heatsink top layer
4
Conditions
single-layer board
four-layer board
6
PCB Cu heatsink area (cm
LIN core system basis chip
8
UJA1079
015aaa138
© NXP B.V. 2010. All rights reserved.
2
[1]
[2]
)
Typ
78
39
10
Unit
K/W
K/W
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