SAM3N4B Atmel Corporation, SAM3N4B Datasheet - Page 737

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SAM3N4B

Manufacturer Part Number
SAM3N4B
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM3N4B

Flash (kbytes)
256 Kbytes
Pin Count
64
Max. Operating Frequency
48 MHz
Cpu
Cortex-M3
# Of Touch Channels
32
Hardware Qtouch Acquisition
No
Max I/o Pins
79
Ext Interrupts
79
Quadrature Decoder Channels
2
Usb Speed
No
Usb Interface
No
Spi
3
Twi (i2c)
2
Uart
4
Ssc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
10
Adc Resolution (bits)
10
Adc Speed (ksps)
384
Resistive Touch Screen
No
Dac Channels
1
Dac Resolution (bits)
10
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
24
Self Program Memory
YES
Dram Memory
No
Nand Interface
No
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
no / no
Timers
6
Output Compare Channels
6
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
36.1
36.2
11011A–ATARM–04-Oct-10
Soldering Profile
Packaging Resources
Table 36-18
Table 36-18. Soldering Profile
Note:
A maximum of three reflow passes is allowed per component.
Land Pattern Definition.
Refer to the following IPC Standards:
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5° C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25° C to Peak Temperature
• IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern
• Atmel Green and RoHS Policy and Package Material Declaration Data Sheet
Standards)
http://www.atmel.com/green/
The package is certified to be backward compatible with Pb/Sn soldering profile.
gives the recommended soldering profile from J-STD-020C.
http://landpatterns.ipc.org/default.asp
Green Package
3° C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260° C
6° C/sec. max.
8 min. max.
SAM3N
737

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