NX3008PBKS NXP Semiconductors, NX3008PBKS Datasheet - Page 13

• Manufacturer Part Number: NX3008PBKS
• Description: Dual P-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Soldering
NX3008PBKS
Product data sheet
Fig 19. Reflow soldering footprint for SOT363 (SC-88)
Fig 20. Wave soldering footprint for SOT363 (SC-88)
4.5
2.35
1.5
1.3
(4×)
0.6
(4×)
0.5
2.45
5.3
(4×)
(4×)
0.5
0.6
All information provided in this document is subject to legal disclaimers.
1.3
2.65
1.8
Rev. 1 — 1 August 2011
(2×)
0.6
1.5
1.5
0.4 (2×)
0.3
30 V, 200 mA dual P-channel Trench MOSFET
2.5
Dimensions in mm
direction during soldering
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
preferred transport
NX3008PBKS
sot363_fr
solder lands
solder resist
occupied area
sot363_fw
© NXP B.V. 2011. All rights reserved.
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